28-6554-11 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 33.32 EUR |
18+ | 29.18 EUR |
27+ | 27.92 EUR |
54+ | 27.02 EUR |
108+ | 26.11 EUR |
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Technische Details 28-6554-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 28-6554-11 nach Preis ab 24.8 EUR bis 34.23 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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28-6554-11 | Hersteller : Aries Electronics | IC & Component Sockets 28 PIN W/HANDLE |
auf Bestellung 106 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-11 | Hersteller : ARIES |
Description: ARIES - 28-6554-11 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, 6554, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 28Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 6554 SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 6 Stücke: Lieferzeit 14-21 Tag (e) |