
24-526-10 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 18.62 EUR |
17+ | 15.25 EUR |
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Technische Details 24-526-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 24-526-10
Foto | Bezeichnung | Hersteller | Beschreibung |
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24-526-10 | Hersteller : ARIES |
![]() tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 24Contacts euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 526 SVHC: No SVHC |
auf Bestellung 16 Stücke: Lieferzeit 14-21 Tag (e) |
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24-526-10 | Hersteller : Aries Electronics |
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Produkt ist nicht verfügbar |