2350616-1 TE Connectivity

Description: DUAL LGA,250 POS, DMD SOCKET, Packaging: Tray, Features: Board Guide, Open Frame, Mounting Type: Surface Mount, Type: LGA, Operating Temperature: -25°C ~ 100°C, Number of Positions or Pins (Grid): 250 (16 x 25), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Material - Mating: Copper Alloy, Part Status: Active.