Technische Details 2287402-1 TE Connectivity
Description: CONN SOCKET LGA 1151POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 1151, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.036" (0.91mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2287402-1
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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2287402-1 | Hersteller : TE Connectivity |
 LGA Sockets SOCKET ASSY LGA1151 0.38AU |
Produkt ist nicht verfügbar |
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2287402-1 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 1151POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 1151 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |
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2287402-1 | Hersteller : TE Connectivity |
IC & Component Sockets SOCKET ASSY LGA1151 0.38AU |
Produkt ist nicht verfügbar |