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222-3343-00-0602J 3M Electronic Solutions Division
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IC & Component Sockets 0.100" DIP SOCKET 22 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 41.98 EUR |
5+ | 41.31 EUR |
10+ | 37.22 EUR |
20+ | 35.75 EUR |
50+ | 35.11 EUR |
100+ | 34.14 EUR |
200+ | 32.58 EUR |
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Technische Details 222-3343-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 22POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 222-3343-00-0602J nach Preis ab 36.62 EUR bis 45.16 EUR
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222-3343-00-0602J | Hersteller : 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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222-3343-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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222-3343-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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222-3343-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |