22-4518-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 224 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.73 EUR |
10+ | 4.29 EUR |
25+ | 4.06 EUR |
50+ | 3.97 EUR |
100+ | 3.78 EUR |
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Produktbewertung abgeben
Technische Details 22-4518-10 Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 22-4518-10
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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22-4518-10 | Hersteller : ARIES |
Description: ARIES - 22-4518-10 - IC- & Baustein-Sockel, 22 Kontakt(e), DIP, 2.54 mm, 518, 10.16 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 22Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 10.16mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
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22-4518-10 | Hersteller : Aries Electronics | IC & Component Sockets 22P IC SOCKET |
Produkt ist nicht verfügbar |