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218-3341-00-0602J 3M Electronic Solutions Division
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IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 42.35 EUR |
10+ | 37.08 EUR |
20+ | 33.63 EUR |
50+ | 32.52 EUR |
100+ | 32.23 EUR |
200+ | 29.81 EUR |
500+ | 29.44 EUR |
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Technische Details 218-3341-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 18POS GLD, Features: Closed Frame, Packaging: Tray, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 218-3341-00-0602J
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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218-3341-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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218-3341-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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218-3341-00-0602J | Hersteller : 3M |
![]() Features: Closed Frame Packaging: Tray Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |