214-99-308-01-670800 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 8POS TIN-LEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 756 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.83 EUR |
| 12+ | 1.55 EUR |
| 25+ | 1.49 EUR |
| 50+ | 1.46 EUR |
| 100+ | 1.39 EUR |
| 250+ | 1.27 EUR |
| 500+ | 1.14 EUR |
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Technische Details 214-99-308-01-670800 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS TIN-LEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 214-99-308-01-670800 nach Preis ab 0.93 EUR bis 1.9 EUR
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214-99-308-01-670800 | Hersteller : Mill-Max |
IC & Component Sockets 8P SMD IC SOCKET |
auf Bestellung 1570 Stücke: Lieferzeit 10-14 Tag (e) |
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