auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 20.86 EUR |
| 10+ | 18.96 EUR |
| 25+ | 18.48 EUR |
| 50+ | 17.05 EUR |
| 100+ | 16.10 EUR |
| 250+ | 14.70 EUR |
| 500+ | 13.73 EUR |
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Technische Details 20-823-90 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 20-823-90 nach Preis ab 13.55 EUR bis 22.40 EUR
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20-823-90 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 20POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1096 Stücke: Lieferzeit 10-14 Tag (e) |
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