1571994-2 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Copper
Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Copper
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Technische Details 1571994-2 TE Connectivity AMP Connectors
Description: CONN SOCKET SIP 2POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper.
Weitere Produktangebote 1571994-2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
1571994-2 | Hersteller : TE Connectivity / AMP | IC & Component Sockets 510-AG91D-2LF= SIP GOLD/TIN |
Produkt ist nicht verfügbar |