Technische Details 1206SFF175F/63-2 Littelfuse
Description: FUSE BOARD MNT 1.75A 63VDC 1206, Packaging: Tape & Reel (TR), Package / Case: 1206 (3216 Metric), Size / Dimension: 0.126" L x 0.063" W x 0.043" H (3.20mm x 1.60mm x 1.10mm), Fuse Type: Board Mount (Cartridge Style Excluded), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Response Time: Fast Blow, Approval Agency: UL, Breaking Capacity @ Rated Voltage: 50A, Current Rating (Amps): 1.75 A, Voltage Rating - DC: 63 V, Melting I²t: 0.045.
Weitere Produktangebote 1206SFF175F/63-2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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1206SFF175F/63-2 | Hersteller : Littelfuse | Fuse Chip Fast Acting 1.75A 63V SMD Solder Pad 1206 Ceramic T/R |
Produkt ist nicht verfügbar |
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1206SFF175F/63-2 | Hersteller : Littelfuse Inc. |
Description: FUSE BOARD MNT 1.75A 63VDC 1206 Packaging: Tape & Reel (TR) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.126" L x 0.063" W x 0.043" H (3.20mm x 1.60mm x 1.10mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Fast Blow Approval Agency: UL Breaking Capacity @ Rated Voltage: 50A Current Rating (Amps): 1.75 A Voltage Rating - DC: 63 V Melting I²t: 0.045 |
Produkt ist nicht verfügbar |
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1206SFF175F/63-2 | Hersteller : Littelfuse Inc. |
Description: FUSE BOARD MNT 1.75A 63VDC 1206 Packaging: Cut Tape (CT) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.126" L x 0.063" W x 0.043" H (3.20mm x 1.60mm x 1.10mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Fast Blow Approval Agency: UL Breaking Capacity @ Rated Voltage: 50A Current Rating (Amps): 1.75 A Voltage Rating - DC: 63 V Melting I²t: 0.045 |
Produkt ist nicht verfügbar |