![116-83-628-41-003101 116-83-628-41-003101](https://download.siliconexpert.com/pdfs/2017/5/20/14/52/54/456/pdd_/manual/tif_110.jpg)
116-83-628-41-003101 Preci-Dip
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 116-83-628-41-003101 Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Bulk, Features: Elevated, Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 116-83-628-41-003101
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
![]() |
116-83-628-41-003101 | Hersteller : Preci-Dip |
![]() Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
|
116-83-628-41-003101 | Hersteller : Preci-dip |
![]() |
Produkt ist nicht verfügbar |