![116-83-432-41-009101 116-83-432-41-009101](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/506/MFG_116-83-432-41-009101.jpg)
116-83-432-41-009101 Preci-Dip
![Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101](/images/adobe-acrobat.png)
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 116-83-432-41-009101 Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD, Packaging: Bulk, Features: Elevated, Open Frame, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 116-83-432-41-009101
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
116-83-432-41-009101 | Hersteller : Preci-dip |
![]() |
Produkt ist nicht verfügbar |