auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 9.38 EUR |
| 10+ | 7.36 EUR |
| 112+ | 7.02 EUR |
| 252+ | 6.42 EUR |
| 504+ | 5.91 EUR |
| 1008+ | 5.49 EUR |
| 2520+ | 5.26 EUR |
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Technische Details 110-93-314-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-93-314-41-801000 nach Preis ab 8.12 EUR bis 10.16 EUR
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110-93-314-41-801000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 14POS GOLDFeatures: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 146 Stücke: Lieferzeit 10-14 Tag (e) |
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