10150098-3200RLF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCIMinitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance.
auf Bestellung 1136 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 41+ | 3.73 EUR |
| 86+ | 1.71 EUR |
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Produktbewertung abgeben
Technische Details 10150098-3200RLF Amphenol Communications Solutions-FCI
Description: CONN MICROSPEED 1.00MM BOARD-, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Number of Positions: 32, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.226" (5.74mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.059" (1.50mm), Contact Length - Mating: 0.114" (2.90mm).
Weitere Produktangebote 10150098-3200RLF nach Preis ab 4.81 EUR bis 10.67 EUR
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10150098-3200RLF | Hersteller : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
auf Bestellung 2400 Stücke: Lieferzeit 14-21 Tag (e) |
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10150098-3200RLF | Hersteller : Amphenol Communications Solutions-FCI |
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance. |
auf Bestellung 2000 Stücke: Lieferzeit 14-21 Tag (e) |
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10150098-3200RLF | Hersteller : Amphenol FCI |
Board to Board & Mezzanine Connectors 1.00MM MINITEK BTB RA |
auf Bestellung 1186 Stücke: Lieferzeit 10-14 Tag (e) |
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10150098-3200RLF | Hersteller : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
auf Bestellung 2388 Stücke: Lieferzeit 10-14 Tag (e) |
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10150098-3200RLF | Hersteller : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
auf Bestellung 2388 Stücke: Lieferzeit 10-14 Tag (e) |
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10150098-3200RLF | Hersteller : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150098-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Rows Rastermaß: 1mm SVHC: No SVHC (12-Jan-2017) |
auf Bestellung 750 Stücke: Lieferzeit 14-21 Tag (e) |
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10150098-3200RLF | Hersteller : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150098-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (17-Jan-2023) |
auf Bestellung 2400 Stücke: Lieferzeit 14-21 Tag (e) |
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| 10150098-3200RLF | Hersteller : FCI |
Conn Wire to Board M 32 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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| 10150098-3200RLF | Hersteller : AMPHENOL |
101500983200RL-0 Signal connectors - Unclassified |
Produkt ist nicht verfügbar |
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10150098-3200RLF | Hersteller : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
Produkt ist nicht verfügbar |