10150097-3200RLF

10150097-3200RLF Amphenol Communications Solutions-FCI


bwb_minitek_microspeed_1_00mm_btb.pdf Hersteller: Amphenol Communications Solutions-FCI
Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance.
auf Bestellung 780 Stücke:

Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
40+3.9 EUR
54+ 2.77 EUR
Mindestbestellmenge: 40
Produktrezensionen
Produktbewertung abgeben

Technische Details 10150097-3200RLF Amphenol Communications Solutions-FCI

Description: CONN MICROSPEED 1.00MM BOARD-, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Number of Positions: 32, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.409" (10.40mm), Row Spacing - Mating: 0.059" (1.50mm), Number of Rows: 2.

Weitere Produktangebote 10150097-3200RLF nach Preis ab 5.13 EUR bis 11.02 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol Communications Solutions-FCI bwb_minitek_microspeed_1_00mm_btb.pdf Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance.
auf Bestellung 1170 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
390+5.43 EUR
780+ 5.13 EUR
Mindestbestellmenge: 390
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol FCI 10150097.pdf Board to Board & Mezzanine Connectors MICROSPEED VT FEMALE 32P-10150097-3200RLF
auf Bestellung 764 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+6.46 EUR
10+ 5.74 EUR
100+ 5.67 EUR
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol ICC (FCI) 10150097.pdf Description: CONN MICROSPEED 1.00MM BOARD-
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 100VAC
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.94µin (0.100µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.409" (10.40mm)
Row Spacing - Mating: 0.059" (1.50mm)
Number of Rows: 2
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
20+6.92 EUR
100+ 6.79 EUR
200+ 6.65 EUR
400+ 6.53 EUR
Mindestbestellmenge: 20
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol ICC (FCI) 10150097.pdf Description: CONN MICROSPEED 1.00MM BOARD-
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 100VAC
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.94µin (0.100µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.409" (10.40mm)
Row Spacing - Mating: 0.059" (1.50mm)
Number of Rows: 2
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.02 EUR
10+ 10.01 EUR
25+ 9.48 EUR
50+ 9.26 EUR
100+ 8.82 EUR
Mindestbestellmenge: 2
10150097-3200RLF 10150097-3200RLF Hersteller : AMPHENOL COMMUNICATIONS SOLUTIONS 10150097.pdf Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150097-3200RLF - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Bronze
Steckverbindermontage: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Kontakte: 32Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: FCI Minitek MicroSpeed
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (17-Jan-2023)
auf Bestellung 775 Stücke:
Lieferzeit 14-21 Tag (e)
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol Communications Solutions-FCI bwb_minitek_microspeed_1_00mm_btb.pdf Minitek® Microspeed 1.00mm, Board-to-Board Connector, Right Angle Header SMD 26P, Poka yoke.EMI Shielded High Speed BtB Connector supports data applications with up to 25Gb/s and superior EMC performance.
Produkt ist nicht verfügbar
10150097-3200RLF Hersteller : AMPHENOL 10150097.pdf 101500973200RL-0 Board-to-board connectors
Produkt ist nicht verfügbar
10150097-3200RLF 10150097-3200RLF Hersteller : Amphenol ICC (FCI) 10150097.pdf Description: CONN MICROSPEED 1.00MM BOARD-
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 100VAC
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.94µin (0.100µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.409" (10.40mm)
Row Spacing - Mating: 0.059" (1.50mm)
Number of Rows: 2
Produkt ist nicht verfügbar