10140055-11123TLF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCIPCI Express GEN 3 Card Edge, Storage and Server Connector, Integrate Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Technische Details 10140055-11123TLF Amphenol Communications Solutions-FCI
Description: CONN PCI EXP FMALE 164POS 0.039, Features: Board Guide, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Through Hole, Number of Positions: 164, Pitch: 0.039" (1.00mm), Read Out: Dual, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Staggered, Contact Finish Thickness: 15.0µin (0.38µm), Contact Material: Copper Alloy, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote 10140055-11123TLF
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 10140055-11123TLF | Hersteller : Amphenol ICC (FCI) |
Description: CONN PCI EXP FMALE 164POS 0.039 Features: Board Guide Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 164 Pitch: 0.039" (1.00mm) Read Out: Dual Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder, Staggered Contact Finish Thickness: 15.0µin (0.38µm) Contact Material: Copper Alloy Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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10140055-11123TLF | Hersteller : Amphenol FCI |
Power to the Board PCI Express GEN 3 Card Edge Conn Vertical Through Hole 164 Pos 100mm Pitch |
Produkt ist nicht verfügbar |