10-6327-01G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA Pin Array Push Pin Aluminum 30.6°C/W Black Anodized
auf Bestellung 214 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 46+ | 3.38 EUR |
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Technische Details 10-6327-01G Boyd Corporation
Description: HEATSINK BGA W/PUSH PINS, Packaging: Bulk, Material: Aluminum, Length: 1.122" (28.50mm), Shape: Square, Type: Top Mount, Width: 1.122" (28.50mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 2.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 30.60°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 10-6327-01G nach Preis ab 2.48 EUR bis 3.66 EUR
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10-6327-01G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA Pin Array Push Pin Aluminum 30.6°C/W Black Anodized |
auf Bestellung 214 Stücke: Lieferzeit 14-21 Tag (e) |
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10-6327-01G | Hersteller : Aavid |
Heat Sinks Push Pin Heat Sink for BGA, 28.5x28.5x10mm, IC=28x28, Plastic Pins, No Pad |
auf Bestellung 2398 Stücke: Lieferzeit 10-14 Tag (e) |
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10-6327-01G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA Pin Array Push Pin Aluminum 30.6C/W Black Anodized |
auf Bestellung 5470 Stücke: Lieferzeit 14-21 Tag (e) |
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10-6327-01G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA Pin Array Push Pin Aluminum 30.6°C/W Black Anodized |
Produkt ist nicht verfügbar |
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| 10-6327-01G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: attachable; grilled; BGA,FPGA; black; L: 28.5mm; W: 28.5mm Type of heatsink: attachable Heatsink shape: grilled Application: BGA; FPGA Colour: black Length: 28.5mm Width: 28.5mm Height: 10mm Material: aluminium Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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10-6327-01G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/PUSH PINS Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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| 10-6327-01G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: attachable; grilled; BGA,FPGA; black; L: 28.5mm; W: 28.5mm Type of heatsink: attachable Heatsink shape: grilled Application: BGA; FPGA Colour: black Length: 28.5mm Width: 28.5mm Height: 10mm Material: aluminium Material finishing: anodized |
Produkt ist nicht verfügbar |