Technische Details 1-530745-3 TE Connectivity
Description: CONN RCPT 30POS 0.05 GOLD PCB, Packaging: Bulk, Features: Mating Guide, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Gray, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Part Status: Active, Insulation Height: 0.215" (5.45mm), Row Spacing - Mating: 0.150" (3.81mm), Number of Rows: 2.
Weitere Produktangebote 1-530745-3
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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1-530745-3 | Hersteller : TE Connectivity | Conn Board to Board RCP 30 POS 1.27mm Solder ST Thru-Hole Package |
Produkt ist nicht verfügbar |
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1-530745-3 | Hersteller : TE Connectivity | Conn Board to Board RCP 30 POS 1.27mm Solder ST Thru-Hole Package |
Produkt ist nicht verfügbar |
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1-530745-3 | Hersteller : TE Connectivity | Conn Board to Board RCP 30 POS 1.27mm Solder ST Thru-Hole Package |
Produkt ist nicht verfügbar |
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1-530745-3 | Hersteller : TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 30POS 0.05 GOLD PCB Packaging: Bulk Features: Mating Guide Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Gray Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Part Status: Active Insulation Height: 0.215" (5.45mm) Row Spacing - Mating: 0.150" (3.81mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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1-530745-3 | Hersteller : TE Connectivity / AMP | Rectangular Mil Spec Connectors MINI-BOX RCPT ASSY 30P SEALED |
Produkt ist nicht verfügbar |