Produkte > TE CONNECTIVITY > 1-1825094-3

1-1825094-3 TE Connectivity


1825094_Dwg.pdf Hersteller: TE Connectivity
Category: Unclassified
Description: Socket: integrated circuits
Type of integrated: integrated circuits
Anzahl je Verpackung: 1 Stücke
auf Bestellung 2688 Stücke:

Lieferzeit 7-14 Tag (e)
Anzahl Preis ohne MwSt
44+1.64 EUR
350+ 1.43 EUR
650+ 1.42 EUR
1300+ 1.37 EUR
Mindestbestellmenge: 44
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Technische Details 1-1825094-3 TE Connectivity

Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.

Weitere Produktangebote 1-1825094-3 nach Preis ab 1.37 EUR bis 1.64 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
1-1825094-3 Hersteller : TE Connectivity 1825094_Dwg.pdf Category: Unclassified
Description: Socket: integrated circuits
Type of integrated: integrated circuits
auf Bestellung 2688 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
44+1.64 EUR
350+ 1.43 EUR
650+ 1.42 EUR
1300+ 1.37 EUR
Mindestbestellmenge: 44
1-1825094-3 1-1825094-3 Hersteller : TE Connectivity pgurl_13930361550491548.pdf Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube
Produkt ist nicht verfügbar
1-1825094-3 1-1825094-3 Hersteller : TE Connectivity AMP Connectors 1825094_Dwg.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Thermoplastic, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar