0C97055517 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.340" (8.64mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.340" (8.64mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
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Technische Details 0C97055517 Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH, Packaging: Bulk, Material: Beryllium Copper, Length: 24.000" (609.60mm), Type: Fingerstock, Width: 0.340" (8.64mm), Operating Temperature: 121°C, Height: 0.070" (1.78mm), Attachment Method: Adhesive, Plating: Tin, Plating - Thickness: 299.21µin (7.60µm).
Weitere Produktangebote 0C97055517
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
0C97055517 | Hersteller : Laird Performance Materials | EMI Gaskets, Sheets, Absorbers & Shielding TWT,COIL,SNB,PSA |
Produkt ist nicht verfügbar |