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0440670402

0440670402 Molex


0440670402_pcb_headers.pdf Hersteller: Molex
Conn Wire to Board HDR 4 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0™ Tray
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Technische Details 0440670402 Molex

Description: CONN HEADER VERT 4POS 3MM, Packaging: Tray, Features: Board Guide, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 4, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Kinked Pin, Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.158" (4.01mm), Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).

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0440670402 0440670402 Hersteller : Molex 440670402_sd.pdf Description: CONN HEADER VERT 4POS 3MM
Packaging: Tray
Features: Board Guide
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Cable/Wire
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Kinked Pin, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.158" (4.01mm)
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Produkt ist nicht verfügbar