0097053702 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU NICKEL ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 12.008" (305.00mm)
Type: Fingerstock
Width: 1.130" (28.70mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Adhesive
Plating: Nickel, Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
Description: RFI FINGERSTOCK BECU NICKEL ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 12.008" (305.00mm)
Type: Fingerstock
Width: 1.130" (28.70mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Adhesive
Plating: Nickel, Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 46.73 EUR |
10+ | 34.79 EUR |
25+ | 31.73 EUR |
100+ | 28.32 EUR |
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Technische Details 0097053702 Laird Technologies EMI
Description: RFI FINGERSTOCK BECU NICKEL ADH, Packaging: Bulk, Material: Beryllium Copper, Length: 12.008" (305.00mm), Type: Fingerstock, Width: 1.130" (28.70mm), Operating Temperature: 121°C, Height: 0.410" (10.41mm), Attachment Method: Adhesive, Plating: Nickel, Tin, Plating - Thickness: 299.99µin (7.62µm), Part Status: Active.
Weitere Produktangebote 0097053702
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
0097053702 | Hersteller : Laird Performance Materials | EMI Gaskets, Sheets, Absorbers & Shielding AP,STR,BF,PSA .410x1.130x.500x12 |
Produkt ist nicht verfügbar |