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614-87-306-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-306-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-87-308-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-308-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-310-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-310-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-312-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-312-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-314-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-314-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-316-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-316-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-318-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-318-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-320-19-131144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 320POS GOLD
Produkt ist nicht verfügbar
614-87-320-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-87-321-19-121144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 321POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-322-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-87-322-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-87-324-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-324-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-325-18-111144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-328-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-328-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-420-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-420-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-422-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-422-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-424-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-424-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-428-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-428-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-432-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-432-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-610-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-87-610-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-624-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-624-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-628-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-87-632-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-632-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-636-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
614-87-636-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
614-87-640-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
614-87-640-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
614-87-642-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
614-87-642-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
614-87-648-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
614-87-648-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-650-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-650-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-652-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-652-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-950-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
614-87-950-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
614-87-952-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
614-87-952-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
614-87-964-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
614-87-964-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
712-83-102-41-001101 712-83-102-41-001101 Preci-Dip Default.aspx?c=7&i=503&p=160&pdf=1&dsku=712-PP-1NN-41-001101 Description: CONN PIN RCPT .016-.022 SOLDER
Packaging: Strip
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.290" (7.37mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.016" ~ 0.022" (0.41mm ~ 0.56mm)
Tail Diameter: 0.020" (0.51mm)
Socket Depth: 0.146" (3.71mm)
Produkt ist nicht verfügbar
614-87-306-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-306-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-87-308-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-308-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-310-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-310-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-312-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-312-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-314-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-314-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-316-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-316-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-318-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-318-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-320-19-131144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 320POS GOLD
Produkt ist nicht verfügbar
614-87-320-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-87-321-19-121144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 321POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-322-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-87-322-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-87-324-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-324-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-325-18-111144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-328-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-328-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-420-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-420-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-422-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-422-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-424-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-424-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-428-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-428-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-432-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-432-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-610-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-87-610-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-624-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-624-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-87-628-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-87-632-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-632-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-636-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
614-87-636-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
614-87-640-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
614-87-640-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
614-87-642-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
614-87-642-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
614-87-648-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
614-87-648-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-87-650-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-650-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-652-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-652-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-87-950-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
614-87-950-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
614-87-952-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
614-87-952-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
614-87-964-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
614-87-964-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Produkt ist nicht verfügbar
712-83-102-41-001101 Default.aspx?c=7&i=503&p=160&pdf=1&dsku=712-PP-1NN-41-001101
712-83-102-41-001101
Hersteller: Preci-Dip
Description: CONN PIN RCPT .016-.022 SOLDER
Packaging: Strip
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.290" (7.37mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.016" ~ 0.022" (0.41mm ~ 0.56mm)
Tail Diameter: 0.020" (0.51mm)
Socket Depth: 0.146" (3.71mm)
Produkt ist nicht verfügbar
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