Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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558-10-192M16-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 192 (16 x 16) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-192M16-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 192 (16 x 16) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-255M16-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-255M16-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 255 (16 x 16) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-256M16-000101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-256M16-000104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (16 x 16) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-256M20-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-256M20-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 256 (20 x 20) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-272M20-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-272M20-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-292M20-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-292M20-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-352M26-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-352M26-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-356M26-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 356 (26 x 26) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-356M26-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 356 (26 x 26) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-357M19-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-357M19-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-360M19-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-360M19-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-388M26-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-388M26-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-400M20-000101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-400M20-000104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-420M26-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-420M26-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-432M31-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 432 (31 x 31) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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558-10-432M31-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-456M26-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-456M26-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-478M26-131101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-478M26-131104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 478 (26 x 26) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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558-10-480M29-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-480M29-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-500M30-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-500M30-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-504M29-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 504 (29 x 29) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-504M29-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-520M31-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-520M31-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-560M33-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-560M33-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 560 (33 x 33) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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558-10-576M30-001101 | Preci-Dip | Description: PGA SOLDER TAIL 1.27MM |
Produkt ist nicht verfügbar |
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558-10-576M30-001104 | Preci-Dip | Description: BGA SURFACE MOUNT 1.27MM |
Produkt ist nicht verfügbar |
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558-10-600M35-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 600 (35 x 35) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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558-10-600M35-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 600 (35 x 35) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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558-10-652M35-001101 | Preci-Dip |
Description: PGA SOLDER TAIL 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 652 (35 x 35) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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558-10-652M35-001104 | Preci-Dip |
Description: BGA SURFACE MOUNT 1.27MM Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 652 (35 x 35) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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612-83-304-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 4POS GOLD |
Produkt ist nicht verfügbar |
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612-83-306-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
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612-83-308-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
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612-83-310-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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612-83-312-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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612-83-314-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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612-83-316-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 16POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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612-83-318-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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612-83-320-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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612-83-322-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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612-83-324-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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612-83-328-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
558-10-192M16-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-192M16-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-255M16-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-255M16-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M16-000101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M16-000104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M20-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M20-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-272M20-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-272M20-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-356M26-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-356M26-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-357M19-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-357M19-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-432M31-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 224.51 EUR |
13+ | 206.01 EUR |
558-10-432M31-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-480M29-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-480M29-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-504M29-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-504M29-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-576M30-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-576M30-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-600M35-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-600M35-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001101 |
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001104 |
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
612-83-304-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
612-83-306-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
612-83-308-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
612-83-310-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
612-83-312-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-314-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-316-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-318-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-320-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
612-83-322-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
612-83-324-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-328-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar