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SAF4000EL/101S23EK NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
MCIMX516AJM6CR2 NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
auf Bestellung 57750 Stücke:
Lieferzeit 10-14 Tag (e)
6+90.46 EUR
Mindestbestellmenge: 6
MCIMX516AJM6C NXP USA Inc. FSCLS07402-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
auf Bestellung 30202 Stücke:
Lieferzeit 10-14 Tag (e)
6+90.46 EUR
Mindestbestellmenge: 6
MC33FS5502Y0ES MC33FS5502Y0ES NXP USA Inc. Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.32 EUR
10+ 12.03 EUR
25+ 11.47 EUR
80+ 9.96 EUR
260+ 9.52 EUR
Mindestbestellmenge: 2
74ALVCH16374DGG11 74ALVCH16374DGG11 NXP USA Inc. NEXP-S-A0003105462-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 897 Stücke:
Lieferzeit 10-14 Tag (e)
602+0.88 EUR
Mindestbestellmenge: 602
74ALVCH16823DL,512 74ALVCH16823DL,512 NXP USA Inc. PHGLS16184-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 9BIT 56SSOP
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-SSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 9
auf Bestellung 1326 Stücke:
Lieferzeit 10-14 Tag (e)
267+1.81 EUR
Mindestbestellmenge: 267
P5CD016UE/T1AL828V NXP USA Inc. Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK51DN512CLQ10 MK51DN512CLQ10 NXP USA Inc. FSCL-S-A0000572126-1.pdf?t.download=true&u=5oefqw Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP1G175GN,132 74AUP1G175GN,132 NXP USA Inc. PHGLS25102-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 22284 Stücke:
Lieferzeit 10-14 Tag (e)
1361+0.35 EUR
Mindestbestellmenge: 1361
S912XHY256F0MLM S912XHY256F0MLM NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
30+16.67 EUR
Mindestbestellmenge: 30
S912XHY256F0CLM S912XHY256F0CLM NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK51DN256ZCMD10 MK51DN256ZCMD10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TJA1042BT/0Z TJA1042BT/0Z NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.84 EUR
Mindestbestellmenge: 2500
TJA1042BT/0Z TJA1042BT/0Z NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4684 Stücke:
Lieferzeit 10-14 Tag (e)
9+1.99 EUR
10+ 1.77 EUR
25+ 1.68 EUR
100+ 1.38 EUR
250+ 1.29 EUR
500+ 1.14 EUR
1000+ 0.9 EUR
Mindestbestellmenge: 9
TJA1042CT/0Z TJA1042CT/0Z NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.95 EUR
Mindestbestellmenge: 2500
TJA1042CT/0Z TJA1042CT/0Z NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2519 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.22 EUR
10+ 1.99 EUR
25+ 1.89 EUR
100+ 1.55 EUR
250+ 1.45 EUR
500+ 1.28 EUR
1000+ 1.01 EUR
Mindestbestellmenge: 8
FS32K116BRT0MLFT FS32K116BRT0MLFT NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BA891,115 BA891,115 NXP USA Inc. BA891_N.pdf Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.11 EUR
6000+ 0.096 EUR
Mindestbestellmenge: 3000
BA891,115 BA891,115 NXP USA Inc. BA891_N.pdf Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 10942 Stücke:
Lieferzeit 10-14 Tag (e)
31+0.58 EUR
42+ 0.43 EUR
47+ 0.37 EUR
100+ 0.24 EUR
250+ 0.2 EUR
500+ 0.16 EUR
1000+ 0.12 EUR
Mindestbestellmenge: 31
MPC8343CZQADDB MPC8343CZQADDB NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)
7+80.83 EUR
Mindestbestellmenge: 7
MPC8343CZQADDB MPC8343CZQADDB NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
S912XEP768W1CAG S912XEP768W1CAG NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS2088AXN7TTB LS2088AXN7TTB NXP USA Inc. Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
MMA25312BT1 MMA25312BT1 NXP USA Inc. Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MMA25312BT1 MMA25312BT1 NXP USA Inc. Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC56F83783AVLHA MC56F83783AVLHA NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.74 EUR
10+ 22.97 EUR
160+ 19.4 EUR
MC56F83783AMLHA NXP USA Inc. Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Produkt ist nicht verfügbar
FXLS93733AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Produkt ist nicht verfügbar
FS32K116LIT0MFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Produkt ist nicht verfügbar
FX32K116LAT0MFMT NXP USA Inc. S32K1xx.pdf Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BFT0MFMT NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LAT0MFMT NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BRT0MFMT NXP USA Inc. Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LFT0MFMT NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
NCX2200GS125 NCX2200GS125 NXP USA Inc. PHGL-S-A0009458585-1.pdf?t.download=true&u=5oefqw Description: SINGLE LOW VOLTAGE COMPARATOR
Packaging: Bulk
Part Status: Active
auf Bestellung 744606 Stücke:
Lieferzeit 10-14 Tag (e)
2240+0.23 EUR
Mindestbestellmenge: 2240
NCX2202GM NCX2202GM NXP USA Inc. NCX2202.pdf Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NCX2220GU,115 NCX2220GU,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
auf Bestellung 81829 Stücke:
Lieferzeit 10-14 Tag (e)
751+0.66 EUR
Mindestbestellmenge: 751
NCX2220GT,115 NCX2220GT,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
MKM34Z128ACLL5557 NXP USA Inc. MKMxxZxxACxx5.pdf Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA606DK/01,118 SA606DK/01,118 NXP USA Inc. SA606.pdf Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
KW45Z41083AFPBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFTBT KW45Z41082AFTBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFPBT NXP USA Inc. KW45.pdf Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFPBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFTBT KW45Z41053AFTBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFTBT KW45Z41083AFTBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFPBT NXP USA Inc. KW45.pdf Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFTBT KW45Z41052AFTBT NXP USA Inc. KW45.pdf Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
SAF3560HV/V1106Y NXP USA Inc. Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LX2160XC72232B LX2160XC72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
1+1444.4 EUR
74HC4075D-Q100118 74HC4075D-Q100118 NXP USA Inc. 74HC_HCT4075_Q100.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
1076+0.47 EUR
Mindestbestellmenge: 1076
74HC4075PW118 74HC4075PW118 NXP USA Inc. PHGLS06088-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 13880 Stücke:
Lieferzeit 10-14 Tag (e)
1332+0.38 EUR
Mindestbestellmenge: 1332
74HC4075PW-Q100118 74HC4075PW-Q100118 NXP USA Inc. 74HC_HCT4075_Q100.pdf Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)
1298+0.38 EUR
Mindestbestellmenge: 1298
74HC4075N,652 74HC4075N,652 NXP USA Inc. 74HC_HCT4075.pdf Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,112 74HC4075DB,112 NXP USA Inc. 74HC(T)4075_Rev_Feb2017.pdf Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 3245 Stücke:
Lieferzeit 10-14 Tag (e)
952+0.52 EUR
Mindestbestellmenge: 952
74HC4075DB,112 74HC4075DB,112 NXP USA Inc. 74HC(T)4075_Rev_Feb2017.pdf Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 74HC4075DB,118 NXP USA Inc. 74HC(T)4075_Rev_Feb2017.pdf Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 74HC4075DB,118 NXP USA Inc. 74HC(T)4075_Rev_Feb2017.pdf Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 6000 Stücke:
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952+0.52 EUR
Mindestbestellmenge: 952
SAF4000EL/101Z233Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
TEA2095DB1574 NXP USA Inc. get-started-with-the-tea2095db1574:GS-TEA2095DB1574 Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
SAF4000EL/101S23EK
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
MCIMX516AJM6CR2 IMX51AEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
auf Bestellung 57750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+90.46 EUR
Mindestbestellmenge: 6
MCIMX516AJM6C FSCLS07402-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
auf Bestellung 30202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+90.46 EUR
Mindestbestellmenge: 6
MC33FS5502Y0ES
MC33FS5502Y0ES
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.32 EUR
10+ 12.03 EUR
25+ 11.47 EUR
80+ 9.96 EUR
260+ 9.52 EUR
Mindestbestellmenge: 2
74ALVCH16374DGG11 NEXP-S-A0003105462-1.pdf?t.download=true&u=5oefqw
74ALVCH16374DGG11
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-TSSOP
Max Propagation Delay @ V, Max CL: 3.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 897 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
602+0.88 EUR
Mindestbestellmenge: 602
74ALVCH16823DL,512 PHGLS16184-1.pdf?t.download=true&u=5oefqw
74ALVCH16823DL,512
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 9BIT 56SSOP
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-SSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 9
auf Bestellung 1326 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
267+1.81 EUR
Mindestbestellmenge: 267
P5CD016UE/T1AL828V
Hersteller: NXP USA Inc.
Description: P5CD016UE/T1AL828V
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 264KB (264K x 8)
RAM Size: 7.5K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 16K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK51DN512CLQ10 FSCL-S-A0000572126-1.pdf?t.download=true&u=5oefqw
MK51DN512CLQ10
Hersteller: NXP USA Inc.
Description: KINETIS K51: 100MHZ CORTEX-M4 ME
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP1G175GN,132 PHGLS25102-1.pdf?t.download=true&u=5oefqw
74AUP1G175GN,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 22284 Stücke:
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Anzahl Preis ohne MwSt
1361+0.35 EUR
Mindestbestellmenge: 1361
S912XHY256F0MLM
S912XHY256F0MLM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
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30+16.67 EUR
Mindestbestellmenge: 30
S912XHY256F0CLM
S912XHY256F0CLM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 88
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK51DN256ZCMD10 KNTSK50FMLYFS.pdf
MK51DN256ZCMD10
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TJA1042BT/0Z TJA1042.pdf
TJA1042BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+0.84 EUR
Mindestbestellmenge: 2500
TJA1042BT/0Z TJA1042.pdf
TJA1042BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4684 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+1.99 EUR
10+ 1.77 EUR
25+ 1.68 EUR
100+ 1.38 EUR
250+ 1.29 EUR
500+ 1.14 EUR
1000+ 0.9 EUR
Mindestbestellmenge: 9
TJA1042CT/0Z TJA1042.pdf
TJA1042CT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+0.95 EUR
Mindestbestellmenge: 2500
TJA1042CT/0Z TJA1042.pdf
TJA1042CT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HI SPEED 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 8-SO
Part Status: Active
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5 ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2519 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.22 EUR
10+ 1.99 EUR
25+ 1.89 EUR
100+ 1.55 EUR
250+ 1.45 EUR
500+ 1.28 EUR
1000+ 1.01 EUR
Mindestbestellmenge: 8
FS32K116BRT0MLFT
FS32K116BRT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BA891,115 BA891_N.pdf
BA891,115
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3000+0.11 EUR
6000+ 0.096 EUR
Mindestbestellmenge: 3000
BA891,115 BA891_N.pdf
BA891,115
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 35V 715MW SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
auf Bestellung 10942 Stücke:
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31+0.58 EUR
42+ 0.43 EUR
47+ 0.37 EUR
100+ 0.24 EUR
250+ 0.2 EUR
500+ 0.16 EUR
1000+ 0.12 EUR
Mindestbestellmenge: 31
MPC8343CZQADDB MPC8343%28E%29_Man.pdf
MPC8343CZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
auf Bestellung 105 Stücke:
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Anzahl Preis ohne MwSt
7+80.83 EUR
Mindestbestellmenge: 7
MPC8343CZQADDB MPC8343%28E%29_Man.pdf
MPC8343CZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
S912XEP768W1CAG
S912XEP768W1CAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS2088AXN7TTB
LS2088AXN7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
SATA: SATA 6Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
MMA25312BT1
MMA25312BT1
Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MMA25312BT1
MMA25312BT1
Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3GHZ-2.7GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax, WLAN
Voltage - Supply: 3V ~ 5V
Gain: 26dB
Current - Supply: 124mA
Noise Figure: 3.8dB
P1dB: 31dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC56F83783AVLHA MC56F837XXDS.pdf
MC56F83783AVLHA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.74 EUR
10+ 22.97 EUR
160+ 19.4 EUR
MC56F83783AMLHA
Hersteller: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 256KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
Produkt ist nicht verfügbar
FXLS93733AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Produkt ist nicht verfügbar
FS32K116LIT0MFMT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 43
Produkt ist nicht verfügbar
FX32K116LAT0MFMT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K116 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BFT0MFMT
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LAT0MFMT
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FB32K116BRT0MFMT
Hersteller: NXP USA Inc.
Description: S32K116, M0+, FLASH 128K, RAM 17
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
FH32K116LFT0MFMT
Hersteller: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
NCX2200GS125 PHGL-S-A0009458585-1.pdf?t.download=true&u=5oefqw
NCX2200GS125
Hersteller: NXP USA Inc.
Description: SINGLE LOW VOLTAGE COMPARATOR
Packaging: Bulk
Part Status: Active
auf Bestellung 744606 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2240+0.23 EUR
Mindestbestellmenge: 2240
NCX2202GM NCX2202.pdf
NCX2202GM
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE COMPARATOR; OPEN-DRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NCX2220GU,115 NCX2220.pdf
NCX2220GU,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
auf Bestellung 81829 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
751+0.66 EUR
Mindestbestellmenge: 751
NCX2220GT,115 NCX2220.pdf
NCX2220GT,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
MKM34Z128ACLL5557 MKMxxZxxACxx5.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KM34: 50MHZ CORTEX-M0+ M
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA606DK/01,118 SA606.pdf
SA606DK/01,118
Hersteller: NXP USA Inc.
Description: IC MIXER 150MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
KW45Z41083AFPBT KW45.pdf
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFTBT KW45.pdf
KW45Z41082AFTBT
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFPBT KW45.pdf
Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41082AFPBT KW45.pdf
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFTBT KW45.pdf
KW45Z41053AFTBT
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFTBT KW45.pdf
KW45Z41083AFTBT
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41053AFPBT KW45.pdf
Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41052AFTBT KW45.pdf
KW45Z41052AFTBT
Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
SAF3560HV/V1106Y
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LX2160XC72232B
LX2160XC72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1444.4 EUR
74HC4075D-Q100118 74HC_HCT4075_Q100.pdf
74HC4075D-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1076+0.47 EUR
Mindestbestellmenge: 1076
74HC4075PW118 PHGLS06088-1.pdf?t.download=true&u=5oefqw
74HC4075PW118
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 13880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1332+0.38 EUR
Mindestbestellmenge: 1332
74HC4075PW-Q100118 74HC_HCT4075_Q100.pdf
74HC4075PW-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1298+0.38 EUR
Mindestbestellmenge: 1298
74HC4075N,652 74HC_HCT4075.pdf
74HC4075N,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,112 74HC(T)4075_Rev_Feb2017.pdf
74HC4075DB,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 3245 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
952+0.52 EUR
Mindestbestellmenge: 952
74HC4075DB,112 74HC(T)4075_Rev_Feb2017.pdf
74HC4075DB,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 74HC(T)4075_Rev_Feb2017.pdf
74HC4075DB,118
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC4075DB,118 74HC(T)4075_Rev_Feb2017.pdf
74HC4075DB,118
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
952+0.52 EUR
Mindestbestellmenge: 952
SAF4000EL/101Z233Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
TEA2095DB1574 get-started-with-the-tea2095db1574:GS-TEA2095DB1574
Hersteller: NXP USA Inc.
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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