Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35047) > Seite 365 nach 585
Foto | Bezeichnung | Hersteller | Beschreibung |
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MRF8S21100HSR3,128 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MRF8S18120HSR3,128 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MRF7S15100HSR3128 | NXP USA Inc. |
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auf Bestellung 74 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS16/DG/B4215 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BCW61C/DG/B4215 | NXP USA Inc. |
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auf Bestellung 35990 Stücke: Lieferzeit 10-14 Tag (e) |
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BC846B/DG/B4215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BAT54A/DG/B4215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 1 Pair Common Anode Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: SOT-23-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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MIMX8QX6AVLFZAC | NXP USA Inc. |
Description: IC MPU 609FBGA Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) Part Status: Active |
Produkt ist nicht verfügbar |
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PDTB123EU115 | NXP USA Inc. |
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auf Bestellung 145960 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YU115 | NXP USA Inc. |
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auf Bestellung 75890 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YQA147 | NXP USA Inc. |
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auf Bestellung 44000 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123EU135 | NXP USA Inc. |
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auf Bestellung 39549 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YU135 | NXP USA Inc. |
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auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7506-55A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V |
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BGA6289,135 | NXP USA Inc. |
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PMF3800SN,115 | NXP USA Inc. |
Description: MOSFET N-CH 60V 260MA SOT323-3 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 260mA (Ta) Rds On (Max) @ Id, Vgs: 4.5Ohm @ 500mA, 10V Power Dissipation (Max): 560mW (Tc) Vgs(th) (Max) @ Id: 3.3V @ 1mA Supplier Device Package: SC-70 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±15V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 0.85 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V |
auf Bestellung 1895250 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN35EN,115 | NXP USA Inc. |
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auf Bestellung 211087 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN25UN,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6A (Ta) Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V Power Dissipation (Max): 530mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: SC-74 Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V |
auf Bestellung 4555 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN25EN,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta) Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-74 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN27UP,115-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta) Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 950mV @ 250µA Supplier Device Package: 6-TSOP Part Status: Active Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V |
Produkt ist nicht verfügbar |
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PMN20EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 6.7A 6TSOP Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj) Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V Power Dissipation (Max): 545mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-74 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMV28UN,215 | NXP USA Inc. |
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auf Bestellung 6399 Stücke: Lieferzeit 10-14 Tag (e) |
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PH9030AL115 | NXP USA Inc. |
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auf Bestellung 10500 Stücke: Lieferzeit 10-14 Tag (e) |
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PHP225,118-NXP | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
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PHT6N06LT,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 2.5A SOT223 Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 2.5A (Ta) Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SC-73 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): ±13V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 4.5 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V |
auf Bestellung 314004 Stücke: Lieferzeit 10-14 Tag (e) |
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PHT6N06T,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 5.5A SOT223 Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc) Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V Power Dissipation (Max): 8.3W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: SC-73 Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V |
auf Bestellung 11709 Stücke: Lieferzeit 10-14 Tag (e) |
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PSMN3R9-60XS127 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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CBT16211DL,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 56-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Circuit: 12 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 56-SSOP |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF5212LCVM66-NXP | NXP USA Inc. |
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74HCT573DB,112-NXP | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Delay Time - Propagation: 17ns Supplier Device Package: 20-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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LPC2364FET100,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 34K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Not For New Designs Number of I/O: 70 DigiKey Programmable: Not Verified |
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PDTD113ZQA147 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 940 mW Frequency - Transition: 210 MHz Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
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PDTD113ZU115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PDTD143XT215 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk |
Produkt ist nicht verfügbar |
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PDTD123YU115 | NXP USA Inc. | Description: 0.5A, 50V, NPN, SOT323 |
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ASL5008FHV/0Y | NXP USA Inc. |
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74LVC16245AEV,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 56-VFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-VFBGA (4.5x7) Part Status: Active |
auf Bestellung 6865 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1027TK/20/1,118 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
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TJA1027TK/20/1 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
Produkt ist nicht verfügbar |
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OM13062UL,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U37H Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
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OM13022598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11U24 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U24 Platform: IAR KickStart |
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MIMX8MD6DVAJZAA557 | NXP USA Inc. |
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MIMX8MQ6DVAJZAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
auf Bestellung 2060 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MQ6DVAJZAA,557 | NXP USA Inc. |
![]() Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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8MIC-RPI-MX8 | NXP USA Inc. |
![]() Packaging: Bulk Function: Microphone Type: Audio Contents: Board(s) Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1T45U/C025 | NXP USA Inc. |
![]() Packaging: Bulk Output Type: Tri-State Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 420Mbps Channel Type: Bidirectional Output Signal: CMOS, LVTTL Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 5.5 V Voltage - VCCB: 1.2 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
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LPC2420FBD208K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 82K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 340 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC253DB,112-NXP | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Data Selector/Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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JN5179-001-M10Z | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 3965 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q7CVT08AE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-K32L2B3 | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2B Platform: Freedom |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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S08PB16-EVK | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08PB16 Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC5748G-GW-RDB | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5748G Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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BC859CW/ZL115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 280999 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV46F128VLL16 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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A2I20D020GNR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 35dB Test Frequency: 2.2GHz Supplier Device Package: TO-270WB-17 |
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SPC5645SF1VLUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1043AXE7KQA | NXP USA Inc. |
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TDA9989ET/C1,518 | NXP USA Inc. |
Description: IC VIDEO TRANSMITTER 64TFBGA Packaging: Bulk Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V Applications: Consumer Video Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2C |
auf Bestellung 56831 Stücke: Lieferzeit 10-14 Tag (e) |
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BF821/DG/B2215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Frequency - Transition: 60MHz Supplier Device Package: SOT-23-3 (TO-236) Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 50 mA Voltage - Collector Emitter Breakdown (Max): 300 V Power - Max: 250 mW Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
MRF8S21100HSR3,128 |
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Produkt ist nicht verfügbar
MRF8S18120HSR3,128 |
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Hersteller: NXP USA Inc.
Description: RF L BAND, N-CHANNEL
Description: RF L BAND, N-CHANNEL
Produkt ist nicht verfügbar
MRF7S15100HSR3128 |
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auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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3+ | 236.24 EUR |
BAS16/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 0.215A, 100V
Description: RECTIFIER DIODE, 0.215A, 100V
Produkt ist nicht verfügbar
BCW61C/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 35990 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8876+ | 0.048 EUR |
BC846B/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
BAT54A/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
MIMX8QX6AVLFZAC |
Hersteller: NXP USA Inc.
Description: IC MPU 609FBGA
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Part Status: Active
Description: IC MPU 609FBGA
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Part Status: Active
Produkt ist nicht verfügbar
PDTB123EU115 |
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auf Bestellung 145960 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8036+ | 0.067 EUR |
PDTB123YU115 |
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auf Bestellung 75890 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8036+ | 0.067 EUR |
PDTB123YQA147 |
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auf Bestellung 44000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8219+ | 0.067 EUR |
PDTB123EU135 |
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auf Bestellung 39549 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8036+ | 0.064 EUR |
PDTB123YU135 |
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auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8036+ | 0.064 EUR |
BUK7506-55A127 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Produkt ist nicht verfügbar
BGA6289,135 |
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Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER
Description: WIDE BAND LOW POWER AMPLIFIER
Produkt ist nicht verfügbar
PMF3800SN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 260MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 260mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 500mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 1mA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
Description: MOSFET N-CH 60V 260MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 260mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 500mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 1mA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
auf Bestellung 1895250 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5323+ | 0.097 EUR |
PMN35EN,115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
auf Bestellung 211087 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4808+ | 0.1 EUR |
PMN25UN,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Description: MOSFET N-CH 20V 6A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
auf Bestellung 4555 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3328+ | 0.15 EUR |
PMN25EN,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6.2A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Description: MOSFET N-CH 30V 6.2A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3328+ | 0.16 EUR |
PMN27UP,115-NXP |
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Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Description: MOSFET P-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Produkt ist nicht verfügbar
PMN20EN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2664+ | 0.19 EUR |
PMV28UN,215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
auf Bestellung 6399 Stücke:
Lieferzeit 10-14 Tag (e)PH9030AL115 |
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Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR
Description: POWER FIELD-EFFECT TRANSISTOR
auf Bestellung 10500 Stücke:
Lieferzeit 10-14 Tag (e)PHP225,118-NXP |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
PHT6N06LT,135 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 2.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.5A (Ta)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 4.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
Description: MOSFET N-CH 55V 2.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.5A (Ta)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 4.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
auf Bestellung 314004 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1332+ | 0.38 EUR |
PHT6N06T,135 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 5.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
Description: MOSFET N-CH 55V 5.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
auf Bestellung 11709 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1332+ | 0.38 EUR |
PSMN3R9-60XS127 |
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Produkt ist nicht verfügbar
CBT16211DL,518 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-SSOP
Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Packaging: Bulk
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-SSOP
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
579+ | 0.84 EUR |
MCF5212LCVM66-NXP |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Produkt ist nicht verfügbar
74HCT573DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Produkt ist nicht verfügbar
LPC2364FET100,518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PDTD113ZQA147 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Produkt ist nicht verfügbar
PDTD113ZU115 |
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Hersteller: NXP USA Inc.
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PDTD143XT215 |
Produkt ist nicht verfügbar
PDTD123YU115 |
Hersteller: NXP USA Inc.
Description: 0.5A, 50V, NPN, SOT323
Description: 0.5A, 50V, NPN, SOT323
Produkt ist nicht verfügbar
74LVC16245AEV,518 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
auf Bestellung 6865 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
143+ | 3.7 EUR |
TJA1027TK/20/1,118 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
TJA1027TK/20/1 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
OM13062UL,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Produkt ist nicht verfügbar
OM13022598 |
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Produkt ist nicht verfügbar
MIMX8MD6DVAJZAA557 |
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Hersteller: NXP USA Inc.
Description: 8M QUAD APPLICATIONS PROCESSOR
Description: 8M QUAD APPLICATIONS PROCESSOR
Produkt ist nicht verfügbar
MIMX8MQ6DVAJZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
auf Bestellung 2060 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 110.48 EUR |
MIMX8MQ6DVAJZAA,557 |
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Hersteller: NXP USA Inc.
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
8MIC-RPI-MX8 |
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Hersteller: NXP USA Inc.
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 390.16 EUR |
74LVC1T45U/C025 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
LPC2420FBD208K |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 340 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.48 EUR |
10+ | 17.96 EUR |
180+ | 16.38 EUR |
74HC253DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Produkt ist nicht verfügbar
JN5179-001-M10Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 3965 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
24+ | 21.37 EUR |
MCIMX6Q7CVT08AE |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 150.62 EUR |
10+ | 124.22 EUR |
FRDM-K32L2B3 |
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Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 50.34 EUR |
S08PB16-EVK |
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Hersteller: NXP USA Inc.
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 47.63 EUR |
MPC5748G-GW-RDB |
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Hersteller: NXP USA Inc.
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 910.08 EUR |
BC859CW/ZL115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 280999 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.035 EUR |
MKV46F128VLL16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
A2I20D020GNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Produkt ist nicht verfügbar
SPC5645SF1VLUR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS1043AXE7KQA |
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Hersteller: NXP USA Inc.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Produkt ist nicht verfügbar
TDA9989ET/C1,518 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TRANSMITTER 64TFBGA
Packaging: Bulk
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V
Applications: Consumer Video
Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2C
Description: IC VIDEO TRANSMITTER 64TFBGA
Packaging: Bulk
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V
Applications: Consumer Video
Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2C
auf Bestellung 56831 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
128+ | 3.82 EUR |
BF821/DG/B2215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar