Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35047) > Seite 353 nach 585
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S9S08AW48E5CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08AW60E5CPUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08AW48E5MPUER | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ60F2MLCR | NXP USA Inc. | Description: IC MCU 8BIT 60KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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S9S08AW48E5VPUE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DN48F2VLF | NXP USA Inc. | Description: IC MCU 8BIT 48KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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S9S08AW48E5MPUE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DN32F2MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 |
Produkt ist nicht verfügbar |
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S9S08DZ32F2VLF | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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S9S12DG12F1VFUE | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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USB-KW38 | NXP USA Inc. |
 Description: WIRELESS PACKET SNIFFER USBPackaging: Bulk For Use With/Related Products: KW38 Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5.x Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1830FET180,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 118 DigiKey Programmable: Not Verified |
auf Bestellung 189 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33910G5ACR2 | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33910G5ACR2 | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP 32LQFP Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MFRC52202HN1 | NXP USA Inc. |
Description: IC READER 32-HVQFN Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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| OM11074598 | NXP USA Inc. |
Description: IRD-LPC1768-DEV - INDUSTRIAL CO Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MPC5746R-176DS | NXP USA Inc. |
Description: MPC5746R EVAL BRD |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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Z0107NA0116 | NXP USA Inc. |
Description: TRIAC TO92 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1761T/N2/DG | NXP USA Inc. |
Description: SWITCHING REGULATOR/CONTROLLER, Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| HEF4030BT-Q100118 | NXP USA Inc. |
Description: XOR GATE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BAT54CW/6115 | NXP USA Inc. |
Description: DIODE ARR SCHOT 30V 200MA SOT323 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: SOT-323 Operating Temperature - Junction: 150°C (Max) Grade: Automotive Part Status: Active Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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74HCT366DB,112 | NXP USA Inc. |
Description: IC HEX BUFFER/LINE DVR 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 2949 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F8006VWLR | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 28SOIC Packaging: Cut Tape (CT) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 15x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MPXHZ6400AC6T1,128 | NXP USA Inc. |
Description: 20 TO 400 KPA, ABSOLUTE, INTEGRA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MK66FX1M0VMD18 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 925 Stücke: Lieferzeit 10-14 Tag (e) |
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BFG310W/XR,115 | NXP USA Inc. |
Description: RF TRANS NPN 6V 14GHZ CMPAK-4 Packaging: Bulk Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Gain: 18dB Power - Max: 60mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 6V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V Frequency - Transition: 14GHz Noise Figure (dB Typ @ f): 1dB @ 2GHz Supplier Device Package: CMPAK-4 |
auf Bestellung 8983 Stücke: Lieferzeit 10-14 Tag (e) |
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PXAG37KFBD,157 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB OTP 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 32KB (32K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: OTP Core Processor: XA Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: UART/USART Peripherals: PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 480 Stücke: Lieferzeit 10-14 Tag (e) |
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P87C51RC2BBD157 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 44LQFP Packaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 33MHz Program Memory Size: 32KB (32K x 8) RAM Size: 512 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 32 |
Produkt ist nicht verfügbar |
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P87C58X2BBD,157-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, 80C51 CP |
auf Bestellung 3215 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1055T/3/1 | NXP USA Inc. |
Description: IC TXRX CAN ENH FAULT-TOL 14SOIC Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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SPC5744PFK1AMLQ9 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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BC56PAS115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC1G99GT/S505115 | NXP USA Inc. |
Description: MAJORITY LOGIC GATE Packaging: Bulk Package / Case: 8-XFDFN Output Type: Tri-State Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 4 Schmitt Trigger Input: Yes Supplier Device Package: 8-XSON (1.95x1) Number of Circuits: 1 |
auf Bestellung 118630 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G99GT/S500115 | NXP USA Inc. |
Description: MAJORITY LOGIC GATE Packaging: Bulk Package / Case: 8-XFDFN Output Type: Tri-State Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 4 Schmitt Trigger Input: Yes Supplier Device Package: 8-XSON (1.95x1) Number of Circuits: 1 |
auf Bestellung 105000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TCVR50A-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TVR100A-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC |
Produkt ist nicht verfügbar |
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| 74LVC1G80GW/AU125 | NXP USA Inc. |
Description: D FLIP-FLOP, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74LVC1G80GW-Q100125 | NXP USA Inc. |
Description: D FLIP-FLOP, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PEMI4QFN/WP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/18.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 30dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI6QFN/WP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/18.5PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 30dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LFMAJ04PLT | NXP USA Inc. |
Description: MPC5604P NEXUS DEBUG BOARD Packaging: Bulk For Use With/Related Products: MPC5604P Accessory Type: Adapter |
Produkt ist nicht verfügbar |
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74AHC132D-Q100118 | NXP USA Inc. |
Description: IC GATE NAND Features: Schmitt Trigger Input Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2.2V ~ 3.85V Input Logic Level - Low: 0.9V ~ 1.65V Max Propagation Delay @ V, Max CL: 9.7ns @ 5V, 50pF Grade: Automotive Part Status: Active Number of Circuits: 4 Current - Quiescent (Max): 2 µA Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC132D/S400118 | NXP USA Inc. |
Description: NAND GATE, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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S9KEAZN32AVLCR | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9KEAZN64AVLCR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVL64F0VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVLA64F0CLCR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 6x10b, 6x12b; D/A1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVLA64F0VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 6x10b, 6x12b; D/A1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC1G175GW/S400125 | NXP USA Inc. |
Description: D FLIP-FLOP, LVC/LCX/Z SERIES, Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC1G175GW-Q100125 | NXP USA Inc. |
Description: D FLIP-FLOP, LVC/LCX/Z SERIES, Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC1G175GV-Q100125 | NXP USA Inc. |
Description: D FLIP-FLOP, LVC/LCX/Z SERIES, Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC1G175GF/S505125 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 2.5 pF Supplier Device Package: 6-XSON (1x1) Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 6930 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF6G15LS-250PBRN112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT1110 Packaging: Bulk Part Status: Active |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF6G15L-250PBRN,1 | NXP USA Inc. |
Description: RF PFET, 3-ELEMENT, L BAND, SILI Packaging: Bulk Package / Case: SOT-1110A Current Rating (Amps): 64A Frequency: 1.47GHz ~ 1.51GHz Power - Output: 60W Gain: 18.5dB Technology: LDMOS Supplier Device Package: LDMOST Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.41 A |
Produkt ist nicht verfügbar |
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74ABTH162245ADGG112 | NXP USA Inc. |
Description: BUS TRANSCVR, ABT SERIES, 8-BIT |
auf Bestellung 1188 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVMC64F1MKH557 | NXP USA Inc. |
Description: 16-BIT FLASH, CPU12 CPU Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 31 |
Produkt ist nicht verfügbar |
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S912ZVML31F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64HLQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BTA330-800BTQ127 | NXP USA Inc. |
Description: 3 QUADRANT TRIAC Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC9S12DT512CPVE | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Bulk Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 512KB (512K x 8) RAM Size: 14K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 |
Produkt ist nicht verfügbar |
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74HCT1G08GV-Q100125 | NXP USA Inc. |
Description: IC GATE AND 1CH 2-INP SC74A Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 2mA, 2mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 20 µA |
Produkt ist nicht verfügbar |
| S9S08AW48E5CFGE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08AW60E5CPUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08AW48E5MPUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08DZ60F2MLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Produkt ist nicht verfügbar
| S9S08AW48E5VPUE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08DN48F2VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Produkt ist nicht verfügbar
| S9S08AW48E5MPUE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S08DN32F2MLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
| S9S08DZ32F2VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
| S9S12DG12F1VFUE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
| USB-KW38 |
|
Hersteller: NXP USA Inc.
Description: WIRELESS PACKET SNIFFER USB
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
Description: WIRELESS PACKET SNIFFER USB
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 120.81 EUR |
| LPC1830FET180,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.84 EUR |
| 10+ | 17.15 EUR |
| 189+ | 14.2 EUR |
| MC33910G5ACR2 |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
| MC33910G5ACR2 |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.15 EUR |
| 10+ | 8.21 EUR |
| 25+ | 7.76 EUR |
| 100+ | 6.72 EUR |
| 250+ | 6.38 EUR |
| 500+ | 5.72 EUR |
| 1000+ | 4.83 EUR |
| OM11074598 |
Hersteller: NXP USA Inc.
Description: IRD-LPC1768-DEV - INDUSTRIAL CO
Packaging: Bulk
Part Status: Active
Description: IRD-LPC1768-DEV - INDUSTRIAL CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MPC5746R-176DS |
|
Hersteller: NXP USA Inc.
Description: MPC5746R EVAL BRD
Description: MPC5746R EVAL BRD
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Z0107NA0116 |
|
Hersteller: NXP USA Inc.
Description: TRIAC TO92
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: TRIAC TO92
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TEA1761T/N2/DG |
|
Hersteller: NXP USA Inc.
Description: SWITCHING REGULATOR/CONTROLLER,
Packaging: Bulk
Part Status: Active
Description: SWITCHING REGULATOR/CONTROLLER,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| HEF4030BT-Q100118 |
Produkt ist nicht verfügbar
| BAT54CW/6115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOT 30V 200MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
Description: DIODE ARR SCHOT 30V 200MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| 74HCT366DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC HEX BUFFER/LINE DVR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC HEX BUFFER/LINE DVR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 2949 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 807+ | 0.6 EUR |
| MC56F8006VWLR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MPXHZ6400AC6T1,128 |
|
Hersteller: NXP USA Inc.
Description: 20 TO 400 KPA, ABSOLUTE, INTEGRA
Packaging: Bulk
Part Status: Active
Description: 20 TO 400 KPA, ABSOLUTE, INTEGRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MK66FX1M0VMD18 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 925 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 39.11 EUR |
| 10+ | 31.36 EUR |
| 80+ | 26.78 EUR |
| BFG310W/XR,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
auf Bestellung 8983 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2219+ | 0.23 EUR |
| PXAG37KFBD,157 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB OTP 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: XA
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 19+ | 27.14 EUR |
| P87C51RC2BBD157 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 32
Description: IC MCU 8BIT 32KB OTP 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 32
Produkt ist nicht verfügbar
| P87C58X2BBD,157-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, 80C51 CP
Description: MICROCONTROLLER, 8 BIT, 80C51 CP
auf Bestellung 3215 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 135+ | 3.85 EUR |
| TJA1055T/3/1 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX CAN ENH FAULT-TOL 14SOIC
Packaging: Bulk
Part Status: Active
Description: IC TXRX CAN ENH FAULT-TOL 14SOIC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| SPC5744PFK1AMLQ9 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 45.94 EUR |
| 10+ | 36.84 EUR |
| BC56PAS115 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G99GT/S505115 |
|
Hersteller: NXP USA Inc.
Description: MAJORITY LOGIC GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: Yes
Supplier Device Package: 8-XSON (1.95x1)
Number of Circuits: 1
Description: MAJORITY LOGIC GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: Yes
Supplier Device Package: 8-XSON (1.95x1)
Number of Circuits: 1
auf Bestellung 118630 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3806+ | 0.13 EUR |
| 74LVC1G99GT/S500115 |
|
Hersteller: NXP USA Inc.
Description: MAJORITY LOGIC GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: Yes
Supplier Device Package: 8-XSON (1.95x1)
Number of Circuits: 1
Description: MAJORITY LOGIC GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 4
Schmitt Trigger Input: Yes
Supplier Device Package: 8-XSON (1.95x1)
Number of Circuits: 1
auf Bestellung 105000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3455+ | 0.14 EUR |
| MPC852TCVR50A-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Description: POWERQUICC 32 BIT POWER ARCHITEC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 14+ | 35.04 EUR |
| MPC852TVR100A-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Description: POWERQUICC 32 BIT POWER ARCHITEC
Produkt ist nicht verfügbar
| 74LVC1G80GW/AU125 |
|
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: D FLIP-FLOP, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G80GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: D FLIP-FLOP, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PEMI4QFN/WP,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |
| PEMI6QFN/WP,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1902+ | 0.26 EUR |
| LFMAJ04PLT |
Hersteller: NXP USA Inc.
Description: MPC5604P NEXUS DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5604P
Accessory Type: Adapter
Description: MPC5604P NEXUS DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5604P
Accessory Type: Adapter
Produkt ist nicht verfügbar
| 74AHC132D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND
Features: Schmitt Trigger Input
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 9.7ns @ 5V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Qualification: AEC-Q100
Description: IC GATE NAND
Features: Schmitt Trigger Input
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2.2V ~ 3.85V
Input Logic Level - Low: 0.9V ~ 1.65V
Max Propagation Delay @ V, Max CL: 9.7ns @ 5V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2500+ | 0.19 EUR |
| 74AHC132D/S400118 |
|
Hersteller: NXP USA Inc.
Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| S9KEAZN32AVLCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9KEAZN64AVLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVL64F0VLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVLA64F0CLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVLA64F0VLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVC1G175GW/S400125 |
|
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G175GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G175GV-Q100125 |
|
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Description: D FLIP-FLOP, LVC/LCX/Z SERIES,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G175GF/S505125 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 2.5 pF
Supplier Device Package: 6-XSON (1x1)
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 2.5 pF
Supplier Device Package: 6-XSON (1x1)
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 6930 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1210+ | 0.42 EUR |
| BLF6G15LS-250PBRN112 |
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 244.33 EUR |
| BLF6G15L-250PBRN,1 |
|
Hersteller: NXP USA Inc.
Description: RF PFET, 3-ELEMENT, L BAND, SILI
Packaging: Bulk
Package / Case: SOT-1110A
Current Rating (Amps): 64A
Frequency: 1.47GHz ~ 1.51GHz
Power - Output: 60W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.41 A
Description: RF PFET, 3-ELEMENT, L BAND, SILI
Packaging: Bulk
Package / Case: SOT-1110A
Current Rating (Amps): 64A
Frequency: 1.47GHz ~ 1.51GHz
Power - Output: 60W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.41 A
Produkt ist nicht verfügbar
| 74ABTH162245ADGG112 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, ABT SERIES, 8-BIT
Description: BUS TRANSCVR, ABT SERIES, 8-BIT
auf Bestellung 1188 Stücke:
Lieferzeit 10-14 Tag (e)| S912ZVMC64F1MKH557 |
|
Hersteller: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
Produkt ist nicht verfügbar
| S912ZVML31F1MKHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12DT512CPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Produkt ist nicht verfügbar
| 74HCT1G08GV-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Description: IC GATE AND 1CH 2-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 27ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Produkt ist nicht verfügbar