Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35280) > Seite 294 nach 588
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MKM34Z256VLQ7 | NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 99 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKS22FN128VLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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MKS22FN256VLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 1x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MKS22FN256VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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MKV10Z32VFM7R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 75MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV10Z64VFM7P | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 75MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV10Z64VLF7P | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV11Z128VFM7P | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 75MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV11Z128VLF7P | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV11Z128VLH7P | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV30F128VLF10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV30F64VLF10R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKV56F1M0VLL24 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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MKV56F1M0VLQ24 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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MKV58F512VLQ24 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 4x12b, 1x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 111 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MKW31Z512CAT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 75UFBGA Packaging: Tape & Reel (TR) Package / Case: 75-UFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.36GHz ~ 2.48GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.76mA Data Rate (Max): 1Mbps Current - Transmitting: 6.08mA Supplier Device Package: 75-WLCSP (3.89x3.8) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW40Z160VHT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 64VFLGA Packaging: Tape & Reel (TR) Package / Case: 64-VFLGA Sensitivity: -102dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 160kB Flash, 20kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.45V ~ 3.6V Power - Output: 5dBm Protocol: Bluetooth v4.1, ZigBee Current - Receiving: 6.5mA ~ 15.4mA Data Rate (Max): 1Mbps Current - Transmitting: 8.4mA ~ 18.5mA Supplier Device Package: 64-VFLGA (7x7) GPIO: 28 Modulation: GFSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MKW41Z512CAT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 75WLCSP Packaging: Tape & Reel (TR) Package / Case: 75-UFBGA, WLCSP Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.36GHz ~ 2.48GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.76mA Data Rate (Max): 1Mbps Current - Transmitting: 6.08mA Supplier Device Package: 75-WLCSP (3.89x3.8) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW41Z512VHT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 64VFLGA Packaging: Tape & Reel (TR) Package / Case: 64-VFLGA Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.36GHz ~ 2.48GHz Memory Size: 512kB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.76mA Data Rate (Max): 1Mbps Current - Transmitting: 6.08mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMG3014N-EVKB1 | NXP USA Inc. |
Description: EVALUATION KIT MMG3014N OPTIMIZE Packaging: Bulk For Use With/Related Products: MMG3014N Frequency: 40MHz ~ 4GHz Type: Amplifier Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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MMG3014N-EVKB3 | NXP USA Inc. |
Description: MMG3014N REF BRD 2200MHZ 0.4W Packaging: Bulk For Use With/Related Products: MMG3014N Frequency: 1.8GHz ~ 2.2GHz Type: Amplifier Supplied Contents: Board(s) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MMG3014N-EVKB7 | NXP USA Inc. |
Description: MMG3014N REF BRD 2700MHZ 0.4W Packaging: Bulk For Use With/Related Products: MMG3014N Frequency: 2.3GHz ~ 2.7GHz Type: Amplifier Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMG30301BT1 | NXP USA Inc. |
Description: IC AMP CELL 900MHZ-4.3GHZ SOT89A Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 900MHz ~ 4.3GHz RF Type: Cellular, WCDMA Voltage - Supply: 5V Gain: 16.2dB Current - Supply: 258mA Noise Figure: 3.7dB P1dB: 30.1dBm Test Frequency: 2.14GHz Supplier Device Package: SOT-89A |
Produkt ist nicht verfügbar |
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MMPF0100F0AZES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F9ANES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F9ANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F9AZES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 276 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F9AZESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MMPF0100FBANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
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MMPF0200F6AEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56HVQFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 11 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 1220 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMRF2007GNR1 | NXP USA Inc. |
Description: RF LDMOS WIDEBAND INTEGRATED POW Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MMRF2011NT1 | NXP USA Inc. | Description: SINGLE W-CDMA RF LDMOS WIDEBAND |
Produkt ist nicht verfügbar |
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MMRF5014H-500MHZ | NXP USA Inc. |
Description: MMRF5014H REF BOARD 2500MHZ 100W |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMZ38333BT1 | NXP USA Inc. | Description: IC RF AMP 3.4GHZ-3.8GHZ 24HVQFN |
Produkt ist nicht verfügbar |
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| MPC574XG-100DS | NXP USA Inc. |
Description: MPC574XB/C/G EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC574xB/C/G Part Status: Active |
Produkt ist nicht verfügbar |
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| MPC574XG-KITS | NXP USA Inc. | Description: MPC574XB/C/G EVAL BRD |
Produkt ist nicht verfügbar |
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| MPC7410HX450NE | NXP USA Inc. | Description: NT HITCE RV1.4 |
Produkt ist nicht verfügbar |
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| MRF24300GNR3 | NXP USA Inc. |
Description: RF MOSFET HEMT OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2G Mounting Type: Chassis Mount Frequency: 2.45GHz Power - Output: 300W Technology: HEMT Supplier Device Package: OM-780-2 Gull Voltage - Rated: 32 V |
Produkt ist nicht verfügbar |
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| MRF6V12500GSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L Current Rating (Amps): 200µA Mounting Type: Surface Mount Frequency: 960MHz ~ 1.215GHz Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780GS-2L Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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| MRF7S24250N-3STG | NXP USA Inc. |
Description: MRF7S24250N-3STG Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| MRFE8VP8600HSR5 | NXP USA Inc. | Description: BROADBAND RF POWER LDMOS TRANSIS |
Produkt ist nicht verfügbar |
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| MTRCKTSBNZVM128 | NXP USA Inc. |
Description: MTRCKTSBNZVM128 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC9S12ZVML128 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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MVF62NN152CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Part Status: Active Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
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MWCT1003AVLHR | NXP USA Inc. |
Description: 5W MULTI-COIL AUTO 5V PREMIUM Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: Wireless Power Transmitter Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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MWCT1011AVLH | NXP USA Inc. |
Description: 15W MULTI-COIL AUTO STANDARD Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Supplier Device Package: 64-LQFP (10x10) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1013VLH | NXP USA Inc. |
Description: 32BIT256K FLASHIFR PGM Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Applications: General Purpose Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
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MWCT1013VLHST | NXP USA Inc. | Description: 32BIT256K FLASHSTR CTM |
Produkt ist nicht verfügbar |
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| NCF2957VHN3/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2957XHN4/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961MHN2/0200EJ | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961MHN3/0200EY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF2961MHN3/0212CY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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NCF2971VTT/TPE080J | NXP USA Inc. | Description: KEYLINK LITE 3D |
Produkt ist nicht verfügbar |
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| NCF29A7MHN3/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NHS3100W8/A1V | NXP USA Inc. |
Description: IC RFID READER/TRAN 13.56MHZ DIE Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.72V ~ 3.6V Standards: ISO 14443, NFC Supplier Device Package: Die |
Produkt ist nicht verfügbar |
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| NTAGFCL6M | NXP USA Inc. | Description: NFC DEV TOOL |
Produkt ist nicht verfügbar |
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NVT4857UKAZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 20WLCSP Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Voltage - Supply: 1.1V ~ 3.6V Applications: Memory Card Supplier Device Package: 20-WLCSP (2.1x1.7) Part Status: Active |
auf Bestellung 39685 Stücke: Lieferzeit 10-14 Tag (e) |
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NX5P3363UKZ | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP Packaging: Tape & Reel (TR) Features: Fault Condition Indicator Package / Case: 16-UFBGA, WLCSP Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 35mOhm Input Type: Non-Inverting Voltage - Load: 4V ~ 5.5V Current - Output (Max): 3.3A Ratio - Input:Output: 1:1 Supplier Device Package: 16-WLCSP (2.2x2.2) Fault Protection: Over Current, Over Temperature, Reverse Current Part Status: Active |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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NXQ1TXL5/101J | NXP USA Inc. |
Description: LOW-COST ONE-CHIP 5 V QI WIRELES Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TA) Voltage - Supply: 3.4V ~ 5.25V Applications: Wireless Power Transmitter Current - Supply: 2mA Supplier Device Package: 32-HVQFN (5x5) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OL2385AHN/001B0Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Frequency: 158MHz ~ 960MHz Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Protocol: Sigfox, Wireless M-Bus, Zigbee® Data Rate (Max): 400kbps Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| MKM34Z256VLQ7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKS22FN128VLH12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
| MKS22FN256VLH12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.01 EUR |
| 10+ | 14.92 EUR |
| 160+ | 12.35 EUR |
| MKS22FN256VLL12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
| MKV10Z32VFM7R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV10Z64VFM7P |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV10Z64VLF7P |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV11Z128VFM7P |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV11Z128VLF7P |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV11Z128VLH7P |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV30F128VLF10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV30F64VLF10R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKV56F1M0VLL24 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Produkt ist nicht verfügbar
| MKV56F1M0VLQ24 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
| MKV58F512VLQ24 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 4x12b, 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 4x12b, 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKW31Z512CAT4R |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 75UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 75-UFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 75-WLCSP (3.89x3.8)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 75UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 75-UFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 75-WLCSP (3.89x3.8)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKW40Z160VHT4R |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1, ZigBee
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v4.1, ZigBee
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: GFSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKW41Z512CAT4R |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 75WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 75-UFBGA, WLCSP
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 75-WLCSP (3.89x3.8)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 75WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 75-UFBGA, WLCSP
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 75-WLCSP (3.89x3.8)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKW41Z512VHT4R |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 7.75 EUR |
| MMG3014N-EVKB1 |
Hersteller: NXP USA Inc.
Description: EVALUATION KIT MMG3014N OPTIMIZE
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 40MHz ~ 4GHz
Type: Amplifier
Supplied Contents: Board(s)
Description: EVALUATION KIT MMG3014N OPTIMIZE
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 40MHz ~ 4GHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MMG3014N-EVKB3 |
|
Hersteller: NXP USA Inc.
Description: MMG3014N REF BRD 2200MHZ 0.4W
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 1.8GHz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
Description: MMG3014N REF BRD 2200MHZ 0.4W
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 1.8GHz ~ 2.2GHz
Type: Amplifier
Supplied Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 452.43 EUR |
| MMG3014N-EVKB7 |
|
Hersteller: NXP USA Inc.
Description: MMG3014N REF BRD 2700MHZ 0.4W
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 2.3GHz ~ 2.7GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Active
Description: MMG3014N REF BRD 2700MHZ 0.4W
Packaging: Bulk
For Use With/Related Products: MMG3014N
Frequency: 2.3GHz ~ 2.7GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 437.18 EUR |
| MMG30301BT1 |
Hersteller: NXP USA Inc.
Description: IC AMP CELL 900MHZ-4.3GHZ SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
RF Type: Cellular, WCDMA
Voltage - Supply: 5V
Gain: 16.2dB
Current - Supply: 258mA
Noise Figure: 3.7dB
P1dB: 30.1dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Description: IC AMP CELL 900MHZ-4.3GHZ SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
RF Type: Cellular, WCDMA
Voltage - Supply: 5V
Gain: 16.2dB
Current - Supply: 258mA
Noise Figure: 3.7dB
P1dB: 30.1dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Produkt ist nicht verfügbar
| MMPF0100F0AZES |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.83 EUR |
| 10+ | 15.18 EUR |
| 25+ | 14.48 EUR |
| 80+ | 12.57 EUR |
| MMPF0100F9ANES |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.54 EUR |
| 10+ | 14.94 EUR |
| 25+ | 14.25 EUR |
| 80+ | 12.37 EUR |
| 260+ | 11.82 EUR |
| 520+ | 10.77 EUR |
| MMPF0100F9ANESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 8.91 EUR |
| MMPF0100F9AZES |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 276 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.83 EUR |
| 10+ | 15.18 EUR |
| 25+ | 14.48 EUR |
| 80+ | 12.57 EUR |
| 260+ | 12.01 EUR |
| MMPF0100F9AZESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MMPF0100FBANESR2 |
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
| MMPF0200F6AEP |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 1220 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.22 EUR |
| 10+ | 12.84 EUR |
| 25+ | 12.25 EUR |
| 80+ | 10.63 EUR |
| 260+ | 10.16 EUR |
| 520+ | 9.26 EUR |
| 1040+ | 8.07 EUR |
| MMRF2007GNR1 |
Hersteller: NXP USA Inc.
Description: RF LDMOS WIDEBAND INTEGRATED POW
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: RF LDMOS WIDEBAND INTEGRATED POW
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MMRF2011NT1 |
Hersteller: NXP USA Inc.
Description: SINGLE W-CDMA RF LDMOS WIDEBAND
Description: SINGLE W-CDMA RF LDMOS WIDEBAND
Produkt ist nicht verfügbar
| MMRF5014H-500MHZ |
|
Hersteller: NXP USA Inc.
Description: MMRF5014H REF BOARD 2500MHZ 100W
Description: MMRF5014H REF BOARD 2500MHZ 100W
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| MMZ38333BT1 |
Hersteller: NXP USA Inc.
Description: IC RF AMP 3.4GHZ-3.8GHZ 24HVQFN
Description: IC RF AMP 3.4GHZ-3.8GHZ 24HVQFN
Produkt ist nicht verfügbar
| MPC574XG-100DS |
Hersteller: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC574xB/C/G
Part Status: Active
Description: MPC574XB/C/G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC574xB/C/G
Part Status: Active
Produkt ist nicht verfügbar
| MPC574XG-KITS |
Hersteller: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
| MRF24300GNR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 2.45GHz
Power - Output: 300W
Technology: HEMT
Supplier Device Package: OM-780-2 Gull
Voltage - Rated: 32 V
Description: RF MOSFET HEMT OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 2.45GHz
Power - Output: 300W
Technology: HEMT
Supplier Device Package: OM-780-2 Gull
Voltage - Rated: 32 V
Produkt ist nicht verfügbar
| MRF6V12500GSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Current Rating (Amps): 200µA
Mounting Type: Surface Mount
Frequency: 960MHz ~ 1.215GHz
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Current Rating (Amps): 200µA
Mounting Type: Surface Mount
Frequency: 960MHz ~ 1.215GHz
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
| MRF7S24250N-3STG |
Produkt ist nicht verfügbar
| MRFE8VP8600HSR5 |
Hersteller: NXP USA Inc.
Description: BROADBAND RF POWER LDMOS TRANSIS
Description: BROADBAND RF POWER LDMOS TRANSIS
Produkt ist nicht verfügbar
| MTRCKTSBNZVM128 |
Hersteller: NXP USA Inc.
Description: MTRCKTSBNZVM128
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC9S12ZVML128
Supplied Contents: Board(s)
Description: MTRCKTSBNZVM128
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC9S12ZVML128
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MVF62NN152CMK40 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
| MWCT1003AVLHR |
|
Hersteller: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
| MWCT1011AVLH |
Hersteller: NXP USA Inc.
Description: 15W MULTI-COIL AUTO STANDARD
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: 15W MULTI-COIL AUTO STANDARD
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 17.72 EUR |
| 10+ | 16.02 EUR |
| 25+ | 15.27 EUR |
| MWCT1013VLH |
Hersteller: NXP USA Inc.
Description: 32BIT256K FLASHIFR PGM
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
Description: 32BIT256K FLASHIFR PGM
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
| MWCT1013VLHST |
Hersteller: NXP USA Inc.
Description: 32BIT256K FLASHSTR CTM
Description: 32BIT256K FLASHSTR CTM
Produkt ist nicht verfügbar
| NCF2957VHN3/0200IY |
Produkt ist nicht verfügbar
| NCF2957XHN4/0200IY |
Produkt ist nicht verfügbar
| NCF2961MHN2/0200EJ |
Produkt ist nicht verfügbar
| NCF2961MHN3/0200EY |
Produkt ist nicht verfügbar
| NCF2961MHN3/0212CY |
Produkt ist nicht verfügbar
| NCF29A7MHN3/0200IY |
Produkt ist nicht verfügbar
| NHS3100W8/A1V |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER/TRAN 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.72V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: Die
Description: IC RFID READER/TRAN 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.72V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: Die
Produkt ist nicht verfügbar
| NVT4857UKAZ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: Memory Card
Supplier Device Package: 20-WLCSP (2.1x1.7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: Memory Card
Supplier Device Package: 20-WLCSP (2.1x1.7)
Part Status: Active
auf Bestellung 39685 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10000+ | 1.07 EUR |
| NX5P3363UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Packaging: Tape & Reel (TR)
Features: Fault Condition Indicator
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
Description: IC PWR SWITCH N-CHAN 1:1 16WLCSP
Packaging: Tape & Reel (TR)
Features: Fault Condition Indicator
Package / Case: 16-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.2x2.2)
Fault Protection: Over Current, Over Temperature, Reverse Current
Part Status: Active
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3000+ | 1.26 EUR |
| 6000+ | 1.21 EUR |
| NXQ1TXL5/101J |
|
Hersteller: NXP USA Inc.
Description: LOW-COST ONE-CHIP 5 V QI WIRELES
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 3.4V ~ 5.25V
Applications: Wireless Power Transmitter
Current - Supply: 2mA
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Last Time Buy
Description: LOW-COST ONE-CHIP 5 V QI WIRELES
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 3.4V ~ 5.25V
Applications: Wireless Power Transmitter
Current - Supply: 2mA
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OL2385AHN/001B0Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Data Rate (Max): 400kbps
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Data Rate (Max): 400kbps
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar