Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 255 nach 584
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OM13073,598 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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OM13082UL | NXP USA Inc. |
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auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MC08XSF421EK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC10XS6200EK | NXP USA Inc. |
![]() Features: Status Flag Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XS6225EK | NXP USA Inc. |
![]() Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A, 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XS6325EK | NXP USA Inc. |
![]() Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A, 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XSD200BFK | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
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MC16XSD200BFK | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
Produkt ist nicht verfügbar |
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MC25XS6300EK | NXP USA Inc. |
![]() Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX535DVV2C2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MK21FX512AVMC12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 559 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0AVLH12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 3671 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0AVLK12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 548 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0AVLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 33x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 671 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0AVLQ12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN1M0AVMC12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK22FN512VMP12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 539 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVLH12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 229 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVLK12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVLL12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 33x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 932 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVLQ12 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 151 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVMC12 | NXP USA Inc. | Description: IC MCU 32B 512KB FLASH 121MAPBGA |
Produkt ist nicht verfügbar |
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MK22FX512AVMD12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Active Number of I/O: 100 |
Produkt ist nicht verfügbar |
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MKE02Z16VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MKE02Z32VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1960 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z64VFM4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1940 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I25D012GNR1 | NXP USA Inc. |
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.69GHz RF Type: W-CDMA Voltage - Supply: 26V ~ 32V Gain: 33dB Current - Supply: 110mA P1dB: 12dBm Test Frequency: 2.3GHz Supplier Device Package: TO-270WBG-15 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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A2I25D012NR1 | NXP USA Inc. |
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.69GHz RF Type: W-CDMA Voltage - Supply: 26V ~ 32V Gain: 35dB Current - Supply: 110mA P1dB: 12dBm Test Frequency: 2.3GHz Supplier Device Package: TO-270WB-15 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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A2T07D160W04SR3 | NXP USA Inc. |
Description: FET RF 2CH 70V 803MHZ Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 803MHz Configuration: Dual Power - Output: 30W Gain: 21.5dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 450 mA |
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A2T18H100-25SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4S4 Mounting Type: Chassis Mount Frequency: 1.81GHz Configuration: Dual Power - Output: 18W Gain: 18.1dB Technology: LDMOS Supplier Device Package: NI-780-4S4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 230 mA |
Produkt ist nicht verfügbar |
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A2T21H100-25SR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Configuration: N-Channel Technology: MOSFET |
Produkt ist nicht verfügbar |
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AFT05MS004NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V SOT89A Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 4.9W Gain: 20.9dB Technology: LDMOS Supplier Device Package: SOT-89A Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 29000 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09S200W02GNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2G Mounting Type: Chassis Mount Frequency: 960MHz Power - Output: 56W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Gull Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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AFT09S200W02NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 56W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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AFT09S200W02SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 4W PLD Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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AFT21S240-12SR3 | NXP USA Inc. |
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AFT26P100-4WGSR3 | NXP USA Inc. |
Description: RF MOSFET 2.6GHZ 100W NI780S-6 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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FXLN8362QR1 | NXP USA Inc. |
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auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH8705026T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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FXTH8705116T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP XZAXIS 24QFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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FXTH8709026T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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FXTH8709116T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Output Type: RF Operating Temperature: -40°C ~ 125°C Sensor Type: Tire Pressure Monitoring (TPMS) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FXTH8709126T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP XZAXIS 24QFN Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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KKL15Z128CAD4R | NXP USA Inc. | Description: IC MCU 32BIT 128KB FLASH 35WLCSP |
Produkt ist nicht verfügbar |
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LS101MASE7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
Produkt ist nicht verfügbar |
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LS101MASE7EHA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
Produkt ist nicht verfügbar |
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LS101MASN7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
Produkt ist nicht verfügbar |
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LS101MAXE7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
Produkt ist nicht verfügbar |
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LS1024ASE7JLA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LS1024ASN7ELA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1024ASN7JLA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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LS102MASN7BFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
Produkt ist nicht verfügbar |
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MC08XS6421EKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC10XS6325EKR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC10XSD200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
Produkt ist nicht verfügbar |
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MC16XSD200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
Produkt ist nicht verfügbar |
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MC33901WEFR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33907LAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
auf Bestellung 183 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33908LAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33CM0902WEFR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 2/2 Protocol: CANbus Supplier Device Package: 14-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
OM13073,598 |
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Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC43S37 EVAL BRD
Description: LPCXPRESSO LPC43S37 EVAL BRD
Produkt ist nicht verfügbar
OM13082UL |
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Hersteller: NXP USA Inc.
Description: SHIELD BOARD LPC GEN PURPOSE
Description: SHIELD BOARD LPC GEN PURPOSE
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)MC08XSF421EK |
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Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Description: IC SWITCH HIGH SIDE 32SOIC
Produkt ist nicht verfügbar
MC10XS6200EK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.9 EUR |
10+ | 12.57 EUR |
MC10XS6225EK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.3 EUR |
10+ | 11.12 EUR |
25+ | 10.6 EUR |
MC10XS6325EK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.05 EUR |
10+ | 14.49 EUR |
25+ | 13.82 EUR |
MC10XSD200BFK |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
MC16XSD200BFK |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
MC25XS6300EK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.66 EUR |
10+ | 12.34 EUR |
25+ | 11.76 EUR |
MCIMX535DVV2C2 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MK21FX512AVMC12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 559 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.39 EUR |
10+ | 22.69 EUR |
80+ | 19.16 EUR |
MK22FN1M0AVLH12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 3671 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.04 EUR |
10+ | 22.4 EUR |
160+ | 18.91 EUR |
480+ | 18.8 EUR |
MK22FN1M0AVLK12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 548 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.9 EUR |
10+ | 23.1 EUR |
96+ | 19.51 EUR |
480+ | 19.39 EUR |
MK22FN1M0AVLL12 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 671 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.72 EUR |
10+ | 22.96 EUR |
90+ | 19.39 EUR |
450+ | 19.27 EUR |
MK22FN1M0AVLQ12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 31.1 EUR |
10+ | 24.85 EUR |
120+ | 20.99 EUR |
MK22FN1M0AVMC12 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN512VMP12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 539 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.12 EUR |
10+ | 17.38 EUR |
80+ | 14.39 EUR |
MK22FX512AVLH12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 229 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.45 EUR |
10+ | 19.54 EUR |
160+ | 16.51 EUR |
MK22FX512AVLK12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.33 EUR |
10+ | 20.23 EUR |
96+ | 17.09 EUR |
MK22FX512AVLL12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 932 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.8 EUR |
10+ | 20.62 EUR |
90+ | 17.42 EUR |
450+ | 17.31 EUR |
MK22FX512AVLQ12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 151 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.44 EUR |
10+ | 21.93 EUR |
120+ | 18.52 EUR |
MK22FX512AVMC12 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
MK22FX512AVMD12 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
Produkt ist nicht verfügbar
MKE02Z16VFM4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
MKE02Z32VFM4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1960 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.49 EUR |
10+ | 5.08 EUR |
80+ | 4.16 EUR |
490+ | 4.07 EUR |
980+ | 3.44 EUR |
MKE02Z64VFM4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1940 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.3 EUR |
10+ | 4.14 EUR |
80+ | 3.39 EUR |
490+ | 3.32 EUR |
980+ | 3.06 EUR |
A2I25D012GNR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
Produkt ist nicht verfügbar
A2I25D012NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
Produkt ist nicht verfügbar
A2T07D160W04SR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
A2T18H100-25SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
Produkt ist nicht verfügbar
A2T21H100-25SR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET
Produkt ist nicht verfügbar
AFT05MS004NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 29000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 2.27 EUR |
2000+ | 2.12 EUR |
5000+ | 2.04 EUR |
AFT09S200W02GNR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
AFT09S200W02NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
AFT09S200W02SR3 |
Produkt ist nicht verfügbar
AFT21S240-12SR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI780S-2
Description: FET RF 65V 2.17GHZ NI780S-2
Produkt ist nicht verfügbar
AFT26P100-4WGSR3 |
Produkt ist nicht verfügbar
FXLN8362QR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Description: ACCELEROMETER 4-16G ANALOG 12QFN
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)FXTH8705026T1 |
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Produkt ist nicht verfügbar
FXTH8705116T1 |
Produkt ist nicht verfügbar
FXTH8709026T1 |
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Produkt ist nicht verfügbar
FXTH8709116T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
FXTH8709126T1 |
Hersteller: NXP USA Inc.
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
KKL15Z128CAD4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 35WLCSP
Description: IC MCU 32BIT 128KB FLASH 35WLCSP
Produkt ist nicht verfügbar
LS101MASE7DFA |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
LS101MASE7EHA |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
LS101MASN7DFA |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
LS101MAXE7DFA |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
LS1024ASE7JLA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Produkt ist nicht verfügbar
LS1024ASN7ELA |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 98.54 EUR |
10+ | 79.95 EUR |
LS1024ASN7JLA |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 107.2 EUR |
10+ | 87.57 EUR |
LS102MASN7BFA |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
MC08XS6421EKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
MC10XS6325EKR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Produkt ist nicht verfügbar
MC10XSD200BFKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
MC16XSD200BFKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
MC33901WEFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Description: IC TRANSCEIVER 1/1 8SOIC
Produkt ist nicht verfügbar
MC33907LAE |
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Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.64 EUR |
10+ | 17.13 EUR |
25+ | 16.42 EUR |
80+ | 14.47 EUR |
MC33908LAE |
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Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.25 EUR |
10+ | 17.69 EUR |
25+ | 16.96 EUR |
MC33CM0902WEFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar