Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 245 nach 584
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CBTL05024BSHP | NXP USA Inc. |
 Description: IC MUX/DEMUX SWITCH CHIP 24HVQFNPackaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TA) Applications: Thunderbolt -3db Bandwidth: 10GHz Supplier Device Package: 24-HVQFN (3x3) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 3:1, 2:1 Part Status: Obsolete Number of Channels: 2 |
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MK22DX128VMC5 | NXP USA Inc. |
Description: IC MCU 32B 128KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MK22DX256VMC5 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MK22FN128VLH10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 163 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN128VLL10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 33x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
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MK22FN128VMP10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Number of I/O: 40 DigiKey Programmable: Not Verified |
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MK22FN256VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 121BGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 36x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-BGA (10x10) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
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MK22FN512VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 1265 Stücke: Lieferzeit 10-14 Tag (e) |
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MK50DX256CMD10 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Active Number of I/O: 96 DigiKey Programmable: Not Verified |
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MKL03Z16VFG4 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 16QFN Packaging: Tray Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 1200 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL03Z16VFK4 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 24QFN |
Produkt ist nicht verfügbar |
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MKL03Z32VFG4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 16QFN Packaging: Tray Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 4400 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL03Z32VFK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL03Z8VFG4 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16QFN |
Produkt ist nicht verfügbar |
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MKL03Z8VFK4 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN Packaging: Tray Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK10DX256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 26x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VMC7R | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA |
Produkt ist nicht verfügbar |
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MK50DX128CLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 35 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MKL03Z32CAF4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 20-WLCSP (2x1.61) Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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KKL03Z32CAF4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP |
Produkt ist nicht verfügbar |
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MK10DX256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 26x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
auf Bestellung 5063 Stücke: Lieferzeit 10-14 Tag (e) |
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MK50DX128CLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 35 DigiKey Programmable: Verified |
auf Bestellung 1499 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL03Z32CAF4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Cut Tape (CT) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 20-WLCSP (2x1.61) Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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HEF4025BT,653 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14SO Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 2.4mA, 2.4mA Number of Inputs: 3 Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF Part Status: Obsolete Number of Circuits: 3 |
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MC33907AE | NXP USA Inc. |
Description: IC REG AUTO APPL 6OUT 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Obsolete |
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AFT05MS006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5W Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 6W Gain: 18.3dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Not For New Designs Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
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AFT09MS015NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V PLD-1.5W Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 16W Gain: 17.2dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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| AFT20P060-4GNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780G-4 Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: Dual Power - Output: 6.3W Gain: 18.9dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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| AFT20P140-4WGNR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 1.91GHZ OM780-4GW Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Mounting Type: Surface Mount Frequency: 1.88GHz ~ 1.91GHz Configuration: Dual Power - Output: 24W Gain: 17.8dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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AFT21S140W02GSR3 | NXP USA Inc. |
Description: FET RF 65V 2.14GHZ NI-780S-2 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 32W Gain: 19.3dB Technology: LDMOS Supplier Device Package: NI-780GS-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
Produkt ist nicht verfügbar |
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AFT21S220W02GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 50W Gain: 19.1dB Technology: LDMOS Supplier Device Package: NI-780GS-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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AFT21S220W02SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.14GHz Power - Output: 50W Gain: 19.1dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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AFV09P350-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4 Packaging: Tape & Reel (TR) Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 100W Gain: 19.5dB Technology: LDMOS Supplier Device Package: OM-780-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 860 mA |
Produkt ist nicht verfügbar |
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MC22XSD200BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
Produkt ist nicht verfügbar |
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MC33882PEKR2 | NXP USA Inc. |
Description: IC PWR DRIVER N-CHAN 1:1 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI, Parallel Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 400mOhm Voltage - Load: 8V ~ 25V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33907AER2 | NXP USA Inc. |
Description: IC REG AUTO APPL 6OUT 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 6 Voltage - Input: -1V ~ 40V Operating Temperature: -40°C ~ 125°C Applications: Power Supply, Automotive Applications Supplier Device Package: 48-HLQFP (7x7) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC50XSD200BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
Produkt ist nicht verfügbar |
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MCIMX283DVM4BR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U5DVM10ACR | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
Produkt ist nicht verfügbar |
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| MM9Z1I638BM2EPR2 | NXP USA Inc. |
Description: IC BATT MONITOR MCU LIN 48QFN Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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MM9Z1J638BM2EPR2 | NXP USA Inc. |
Description: IC BATT MONITOR MULTI-CHEM 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: CAN Operating Temperature: -40°C ~ 125°C (TJ) Battery Chemistry: Multi-Chemistry Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
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MMPF0100NPAEPR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100NPAZESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MMPF0200F0ANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 11 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
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MMPF0200F3ANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56QFN |
Produkt ist nicht verfügbar |
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MMPF0200F4AEPR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 11 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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MMPF0200NPAZESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 11 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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MMRF1004GNR1 | NXP USA Inc. |
Description: FET RF 68V 2.17GHZ TO270G-2 Packaging: Tape & Reel (TR) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15.5dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 130 mA |
Produkt ist nicht verfügbar |
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MMRF1004NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15.5dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 130 mA |
Produkt ist nicht verfügbar |
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MMRF1005HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.3GHz Power - Output: 250W Gain: 22.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MMRF1005HSR5 | NXP USA Inc. |
Description: FET RF 120V 1.3GHZ NI-780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.3GHz Power - Output: 250W Gain: 22.7dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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| MMRF1006HSR5 | NXP USA Inc. |
Description: FET RF 2CH 120V 450MHZ NI-1230S Packaging: Tape & Reel (TR) Package / Case: NI-1230S-4 Frequency: 450MHz Power - Output: 1000W Gain: 20dB Technology: LDMOS Supplier Device Package: NI-1230S-4 Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
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| MMRF1007HR5 | NXP USA Inc. |
Description: FET RF 2CH 110V 1.03GHZ NI-1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4H Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 20dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Obsolete Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
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| MMRF1007HSR5 | NXP USA Inc. |
Description: FET RF 2CH 110V 1.03GHZ NI-1230S Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 20dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
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MMRF1008HR5 | NXP USA Inc. |
Description: FET RF 100V 1.03GHZ NI-780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 275W Gain: 20.3dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Last Time Buy Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MMRF1008HSR5 | NXP USA Inc. |
Description: FET RF 100V 1.03GHZ NI-780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 275W Gain: 20.3dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MMRF1009HR5 | NXP USA Inc. |
Description: FET RF 110V 1.03GHZ NI-780S Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Last Time Buy Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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MMRF1009HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Last Time Buy Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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| MMRF1020-04GNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780G-4 Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 100W Gain: 19.5dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 860 mA |
Produkt ist nicht verfügbar |
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MMRF1020-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4 Packaging: Tape & Reel (TR) Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 100W Gain: 19.5dB Technology: LDMOS Supplier Device Package: OM-780-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 860 mA |
Produkt ist nicht verfügbar |
| CBTL05024BSHP |
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Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 10GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Part Status: Obsolete
Number of Channels: 2
Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 10GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
| MK22DX128VMC5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK22DX256VMC5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK22FN128VLH10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.72 EUR |
| 10+ | 9.21 EUR |
| 160+ | 7.63 EUR |
| MK22FN128VLL10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK22FN128VMP10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK22FN256VDC12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 121BGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 36x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-BGA (10x10)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 121BGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 36x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-BGA (10x10)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK22FN512VDC12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 1265 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.03 EUR |
| 10+ | 16 EUR |
| 80+ | 13.51 EUR |
| 696+ | 13.43 EUR |
| 1044+ | 12.68 EUR |
| MK50DX256CMD10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL03Z16VFG4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 1200 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.01 EUR |
| 10+ | 2.34 EUR |
| 80+ | 1.88 EUR |
| 490+ | 1.78 EUR |
| 980+ | 1.56 EUR |
| MKL03Z16VFK4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24QFN
Description: IC MCU 32BIT 16KB FLASH 24QFN
Produkt ist nicht verfügbar
| MKL03Z32VFG4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 4400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.19 EUR |
| 10+ | 4.07 EUR |
| 80+ | 3.27 EUR |
| 490+ | 3.09 EUR |
| 980+ | 2.56 EUR |
| 2450+ | 2.38 EUR |
| MKL03Z32VFK4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.39 EUR |
| 10+ | 4.2 EUR |
| MKL03Z8VFG4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
Description: IC MCU 32BIT 8KB FLASH 16QFN
Produkt ist nicht verfügbar
| MKL03Z8VFK4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK10DX256VLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1500+ | 11.78 EUR |
| MK20DX256VMC7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
| MK50DX128CLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MKL03Z32CAF4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| KKL03Z32CAF4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Produkt ist nicht verfügbar
| MK10DX256VLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 5063 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.77 EUR |
| 10+ | 16.31 EUR |
| 100+ | 13.51 EUR |
| MK50DX128CLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
auf Bestellung 1499 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.05 EUR |
| 10+ | 16.82 EUR |
| 100+ | 14.21 EUR |
| 500+ | 14.12 EUR |
| MKL03Z32CAF4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| HEF4025BT,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Produkt ist nicht verfügbar
| MC33907AE |
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
| AFT05MS006NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| AFT09MS015NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| AFT20P060-4GNR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 6.3W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| AFT20P140-4WGNR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.91GHZ OM780-4GW
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: FET RF 2CH 65V 1.91GHZ OM780-4GW
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
| AFT21S140W02GSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.14GHZ NI-780S-2
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: FET RF 65V 2.14GHZ NI-780S-2
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 32W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
| AFT21S220W02GSR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| AFT21S220W02SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 50W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| AFV09P350-04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Produkt ist nicht verfügbar
| MC22XSD200BEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
| MC33882PEKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
Produkt ist nicht verfügbar
| MC33907AER2 |
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC50XSD200BEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
| MCIMX283DVM4BR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 17.86 EUR |
| MCIMX6U5DVM10ACR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
| MM9Z1I638BM2EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT MONITOR MCU LIN 48QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC BATT MONITOR MCU LIN 48QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| MM9Z1J638BM2EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT MONITOR MULTI-CHEM 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: CAN
Operating Temperature: -40°C ~ 125°C (TJ)
Battery Chemistry: Multi-Chemistry
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Description: IC BATT MONITOR MULTI-CHEM 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: CAN
Operating Temperature: -40°C ~ 125°C (TJ)
Battery Chemistry: Multi-Chemistry
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
| MMPF0100NPAEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 8.47 EUR |
| MMPF0100NPAZESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MMPF0200F0ANESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
| MMPF0200F3ANESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Description: IC REG CONV I.MX6 11OUT 56QFN
Produkt ist nicht verfügbar
| MMPF0200F4AEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| MMPF0200NPAZESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| MMRF1004GNR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 68V 2.17GHZ TO270G-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Description: FET RF 68V 2.17GHZ TO270G-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
| MMRF1004NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
| MMRF1005HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| MMRF1005HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 120V 1.3GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 120V 1.3GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| MMRF1006HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 120V 450MHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: FET RF 2CH 120V 450MHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4
Frequency: 450MHz
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
| MMRF1007HR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 110V 1.03GHZ NI-1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4H
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: FET RF 2CH 110V 1.03GHZ NI-1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4H
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
| MMRF1007HSR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 2CH 110V 1.03GHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: FET RF 2CH 110V 1.03GHZ NI-1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
| MMRF1008HR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 100V 1.03GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 100V 1.03GHZ NI-780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| MMRF1008HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 100V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 100V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| MMRF1009HR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 110V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: FET RF 110V 1.03GHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
| MMRF1009HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Last Time Buy
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
| MMRF1020-04GNR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Produkt ist nicht verfügbar
| MMRF1020-04NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 860 mA
Produkt ist nicht verfügbar