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MCF51CN128CLK MCF51CN128CLK NXP USA Inc. MCF51CN128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Produkt ist nicht verfügbar
TWR-SER TWR-SER NXP USA Inc. TWRSERUM.pdf Description: TOWER SERIAL I/O HARDWARE
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
TWR-ELEV TWR-ELEV NXP USA Inc. TWRMCF51CNQSG.pdf Description: TOWER ELEVATOR HARDWARE 2 BOARDS
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: 2 Elevator Boards
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
1+100.64 EUR
LM75BDP,118 LM75BDP,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 49647 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.58 EUR
5000+ 0.54 EUR
7500+ 0.51 EUR
12500+ 0.5 EUR
17500+ 0.49 EUR
25000+ 0.48 EUR
Mindestbestellmenge: 2500
LM75BGD,125 LM75BGD,125 NXP USA Inc. LM75B.pdf Description: SENSOR DGTL -55C-125C 8XSON
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9527DP,118 PCA9527DP,118 NXP USA Inc. PCA9527.pdf Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
Produkt ist nicht verfügbar
PCA9575HF,118 PCA9575HF,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.79 EUR
Mindestbestellmenge: 6000
PCA9622DR,118 PCA9622DR,118 NXP USA Inc. PCA9622.pdf Description: IC LED DRV LIN PWM 100MA 32TSSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.12 EUR
Mindestbestellmenge: 2000
PCA9626B,118 PCA9626B,118 NXP USA Inc. PCA9626.pdf Description: IC LED DRVR LIN PWM 100MA 48LQFP
Produkt ist nicht verfügbar
PTN3360ABS,518 PTN3360ABS,518 NXP USA Inc. PTN3360A.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
PTN3360BBS,518 PTN3360BBS,518 NXP USA Inc. PTN3360B.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
SC16C850IBS,151 SC16C850IBS,151 NXP USA Inc. SC16C850.pdf Description: IC UART SGL-CH 3.3V 32-HVQFN
Produkt ist nicht verfügbar
SE97TL,147 SE97TL,147 NXP USA Inc. SE97.pdf Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
LM75BDP,118 LM75BDP,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 49729 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.48 EUR
16+ 1.13 EUR
25+ 0.98 EUR
50+ 0.94 EUR
100+ 0.8 EUR
500+ 0.7 EUR
1000+ 0.61 EUR
Mindestbestellmenge: 12
LM75BGD,125 LM75BGD,125 NXP USA Inc. LM75B.pdf Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9527DP,118 PCA9527DP,118 NXP USA Inc. PCA9527.pdf Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
Produkt ist nicht verfügbar
PCA9575HF,118 PCA9575HF,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.07 EUR
10+ 3.64 EUR
25+ 3.44 EUR
100+ 2.93 EUR
250+ 2.75 EUR
500+ 2.4 EUR
1000+ 1.99 EUR
2500+ 1.86 EUR
Mindestbestellmenge: 5
PCA9622DR,118 PCA9622DR,118 NXP USA Inc. PCA9622.pdf Description: IC LED DRV LIN PWM 100MA 32TSSOP
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.9 EUR
10+ 6.2 EUR
25+ 5.86 EUR
100+ 5.08 EUR
250+ 4.82 EUR
500+ 4.32 EUR
1000+ 4.12 EUR
Mindestbestellmenge: 3
PTN3360BBS,518 PTN3360BBS,518 NXP USA Inc. PTN3360B.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
SE97TL,147 SE97TL,147 NXP USA Inc. SE97.pdf Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
SE98ATL,147 SE98ATL,147 NXP USA Inc. SE98A.pdf Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
TDA8950TH/N1,118 TDA8950TH/N1,118 NXP USA Inc. TDA8950.pdf Description: IC AMP D MONO/STEREO 340W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 40V
Max Output Power x Channels @ Load: 340W x 1 @ 8Ohm; 170W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8920CTH/N1,118 TDA8920CTH/N1,118 NXP USA Inc. TDA8920C.pdf Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8920CTH/N1,118 TDA8920CTH/N1,118 NXP USA Inc. TDA8920C.pdf Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11025 OM11025 NXP USA Inc. Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+579.2 EUR
OM11027 OM11027 NXP USA Inc. LPC2939.pdf Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
Produkt ist nicht verfügbar
LPC1751FBD80,551 LPC1751FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1752FBD80,551 LPC1752FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1754FBD80,551 LPC1754FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1756FBD80,551 LPC1756FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.64 EUR
10+ 15.69 EUR
LPC1758FBD80,551 LPC1758FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1765FBD100,551 LPC1765FBD100,551 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1766FBD100,551 LPC1766FBD100,551 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1768FBD100,551 LPC1768FBD100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SSL2101T/DB/FBCB230V,598 SSL2101T/DB/FBCB230V,598 NXP USA Inc. SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf Description: BOARD EVAL LED DRIVER SS2101
Produkt ist nicht verfügbar
SSL2101T/DB/FBCB120V,598 SSL2101T/DB/FBCB120V,598 NXP USA Inc. SSL2101.pdf Description: BOARD EVAL LED DRIVER SS2101
Packaging: Box
Features: Dimmable
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Current - Output / Channel: 400 mA ~ 800 mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1, Isolated
Part Status: Obsolete
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+164.14 EUR
TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 6596 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.18 EUR
10+ 16.43 EUR
25+ 15.66 EUR
100+ 13.6 EUR
250+ 12.99 EUR
500+ 11.84 EUR
TJA1050T/VM,118 TJA1050T/VM,118 NXP USA Inc. TJA1050.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1080ATS/2/T,118 TJA1080ATS/2/T,118 NXP USA Inc. TJA1080A.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+10.31 EUR
Mindestbestellmenge: 1000
TJA1050T/VM,118 TJA1050T/VM,118 NXP USA Inc. TJA1050.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11035 OM11035 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11032,598 OM11032,598 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
Produkt ist nicht verfügbar
JN5148-EK010,596 JN5148-EK010,596 NXP USA Inc. JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf Description: KIT EVAL ZIGBEE PRO JN5148
Produkt ist nicht verfügbar
TJA1041T/VM,518 TJA1041T/VM,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1040T/VM,118 TJA1040T/VM,118 NXP USA Inc. TJA1040.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1040T/VM,118 TJA1040T/VM,118 NXP USA Inc. TJA1040.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041T/VM,518 TJA1041T/VM,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
PN5331B3HN/C270,55 PN5331B3HN/C270,55 NXP USA Inc. PN5331B3HN.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 4410 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.35 EUR
10+ 20.21 EUR
25+ 18.62 EUR
80+ 17.02 EUR
230+ 15.96 EUR
490+ 14.89 EUR
980+ 14.15 EUR
1N4148,133 1N4148,133 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
1N4148,143 1N4148,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
1N4448,143 1N4448,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
ADC1207S080HW/C1,5 ADC1207S080HW/C1,5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Produkt ist nicht verfügbar
ADC1207S080HW/C1:1 ADC1207S080HW/C1:1 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Produkt ist nicht verfügbar
BAW62,133 BAW62,133 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE GEN PURP 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Produkt ist nicht verfügbar
BAW62,143 BAW62,143 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE GEN PURP 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Produkt ist nicht verfügbar
BT136-600E/02,127 BT136-600E/02,127 NXP USA Inc. BT136-600E.pdf Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Produkt ist nicht verfügbar
BUK7510-55AL,127 BUK7510-55AL,127 NXP USA Inc. BUK7510-55AL.pdf Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Produkt ist nicht verfügbar
BUK752R3-40C,127 BUK752R3-40C,127 NXP USA Inc. BUK752R3-40C.pdf Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Produkt ist nicht verfügbar
MCF51CN128CLK MCF51CN128.pdf
MCF51CN128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Produkt ist nicht verfügbar
TWR-SER TWRSERUM.pdf
TWR-SER
Hersteller: NXP USA Inc.
Description: TOWER SERIAL I/O HARDWARE
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
TWR-ELEV TWRMCF51CNQSG.pdf
TWR-ELEV
Hersteller: NXP USA Inc.
Description: TOWER ELEVATOR HARDWARE 2 BOARDS
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: 2 Elevator Boards
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+100.64 EUR
LM75BDP,118 LM75B.pdf
LM75BDP,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 49647 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+0.58 EUR
5000+ 0.54 EUR
7500+ 0.51 EUR
12500+ 0.5 EUR
17500+ 0.49 EUR
25000+ 0.48 EUR
Mindestbestellmenge: 2500
LM75BGD,125 LM75B.pdf
LM75BGD,125
Hersteller: NXP USA Inc.
Description: SENSOR DGTL -55C-125C 8XSON
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9527DP,118 PCA9527.pdf
PCA9527DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
Produkt ist nicht verfügbar
PCA9575HF,118 PCA9575.pdf
PCA9575HF,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6000+1.79 EUR
Mindestbestellmenge: 6000
PCA9622DR,118 PCA9622.pdf
PCA9622DR,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 32TSSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+4.12 EUR
Mindestbestellmenge: 2000
PCA9626B,118 PCA9626.pdf
PCA9626B,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 100MA 48LQFP
Produkt ist nicht verfügbar
PTN3360ABS,518 PTN3360A.pdf
PTN3360ABS,518
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
PTN3360BBS,518 PTN3360B.pdf
PTN3360BBS,518
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
SC16C850IBS,151 SC16C850.pdf
SC16C850IBS,151
Hersteller: NXP USA Inc.
Description: IC UART SGL-CH 3.3V 32-HVQFN
Produkt ist nicht verfügbar
SE97TL,147 SE97.pdf
SE97TL,147
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
LM75BDP,118 LM75B.pdf
LM75BDP,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 49729 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.48 EUR
16+ 1.13 EUR
25+ 0.98 EUR
50+ 0.94 EUR
100+ 0.8 EUR
500+ 0.7 EUR
1000+ 0.61 EUR
Mindestbestellmenge: 12
LM75BGD,125 LM75B.pdf
LM75BGD,125
Hersteller: NXP USA Inc.
Description: SENSOR DGTL -55C-125C 8XSON
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-XFDFN
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9527DP,118 PCA9527.pdf
PCA9527DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Number of Channels: 3
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 100mA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Capacitance - Input: 8 pF
Produkt ist nicht verfügbar
PCA9575HF,118 PCA9575.pdf
PCA9575HF,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.07 EUR
10+ 3.64 EUR
25+ 3.44 EUR
100+ 2.93 EUR
250+ 2.75 EUR
500+ 2.4 EUR
1000+ 1.99 EUR
2500+ 1.86 EUR
Mindestbestellmenge: 5
PCA9622DR,118 PCA9622.pdf
PCA9622DR,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 32TSSOP
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.9 EUR
10+ 6.2 EUR
25+ 5.86 EUR
100+ 5.08 EUR
250+ 4.82 EUR
500+ 4.32 EUR
1000+ 4.12 EUR
Mindestbestellmenge: 3
PTN3360BBS,518 PTN3360B.pdf
PTN3360BBS,518
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: 3-Wire Serial
Voltage - Supply: 3V ~ 3.6V
Applications: Set-Top Boxes, Video Players
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
SE97TL,147 SE97.pdf
SE97TL,147
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.3V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Comparator, Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
SE98ATL,147 SE98A.pdf
SE98ATL,147
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 3.6V 8-HXSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HXSON (2x3)
Produkt ist nicht verfügbar
TDA8950TH/N1,118 TDA8950.pdf
TDA8950TH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 340W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 40V
Max Output Power x Channels @ Load: 340W x 1 @ 8Ohm; 170W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8920CTH/N1,118 TDA8920C.pdf
TDA8920CTH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8920CTH/N1,118 TDA8920C.pdf
TDA8920CTH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 220W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 220W x 1 @ 8Ohm; 125W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11025
OM11025
Hersteller: NXP USA Inc.
Description: EXT BOARD MOTOR CONTROL LPC2900
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: LPC2900
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, Stepper)
Embedded: Yes, MCU, 16/32-Bit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+579.2 EUR
OM11027 LPC2939.pdf
OM11027
Hersteller: NXP USA Inc.
Description: LPC2939 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM9
Utilized IC / Part: LPC2939
Produkt ist nicht verfügbar
LPC1751FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1751FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1752FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1752FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1754FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1754FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1756FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1756FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.64 EUR
10+ 15.69 EUR
LPC1758FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1758FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1765FBD100,551
LPC1765FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1766FBD100,551
LPC1766FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1768FBD100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SSL2101T/DB/FBCB230V,598 SSL2101T_DB_FBCB230V,598_Feb2011_UG.pdf
SSL2101T/DB/FBCB230V,598
Hersteller: NXP USA Inc.
Description: BOARD EVAL LED DRIVER SS2101
Produkt ist nicht verfügbar
SSL2101T/DB/FBCB120V,598 SSL2101.pdf
SSL2101T/DB/FBCB120V,598
Hersteller: NXP USA Inc.
Description: BOARD EVAL LED DRIVER SS2101
Packaging: Box
Features: Dimmable
Voltage - Output: 9V ~ 23V
Voltage - Input: 108 ~ 132 VAC
Current - Output / Channel: 400 mA ~ 800 mA
Utilized IC / Part: SSL2101
Supplied Contents: Board(s)
Outputs and Type: 1, Isolated
Part Status: Obsolete
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+164.14 EUR
TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 6596 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.18 EUR
10+ 16.43 EUR
25+ 15.66 EUR
100+ 13.6 EUR
250+ 12.99 EUR
500+ 11.84 EUR
TJA1050T/VM,118 TJA1050.pdf
TJA1050T/VM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1080ATS/2/T,118 TJA1080A.pdf
TJA1080ATS/2/T,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+10.31 EUR
Mindestbestellmenge: 1000
TJA1050T/VM,118 TJA1050.pdf
TJA1050T/VM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11035 LPC1769_68_67_66_65_64_63.pdf
OM11035
Hersteller: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11032,598 LPC1769_68_67_66_65_64_63.pdf
OM11032,598
Hersteller: NXP USA Inc.
Description: LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, ULINK-ME™ Programmer
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Part Status: Obsolete
Produkt ist nicht verfügbar
JN5148-EK010,596 JN5148%20ZigBee%20PRO%20Eval%20Kits%20Brief.pdf
JN5148-EK010,596
Hersteller: NXP USA Inc.
Description: KIT EVAL ZIGBEE PRO JN5148
Produkt ist nicht verfügbar
TJA1041T/VM,518 TJA1041.pdf
TJA1041T/VM,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1040T/VM,118 TJA1040.pdf
TJA1040T/VM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1040T/VM,118 TJA1040.pdf
TJA1040T/VM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
TJA1041T/VM,518 TJA1041.pdf
TJA1041T/VM,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
PN5331B3HN/C270,55 PN5331B3HN.pdf
PN5331B3HN/C270,55
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 4410 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.35 EUR
10+ 20.21 EUR
25+ 18.62 EUR
80+ 17.02 EUR
230+ 15.96 EUR
490+ 14.89 EUR
980+ 14.15 EUR
1N4148,133 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,133
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
1N4148,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,143
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
1N4448,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4448,143
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
ADC1207S080HW/C1,5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1,5
Hersteller: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Produkt ist nicht verfügbar
ADC1207S080HW/C1:1 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Produkt ist nicht verfügbar
BAW62,133 BAW62_Rev_Feb2017.pdf
BAW62,133
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Produkt ist nicht verfügbar
BAW62,143 BAW62_Rev_Feb2017.pdf
BAW62,143
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Produkt ist nicht verfügbar
BT136-600E/02,127 BT136-600E.pdf
BT136-600E/02,127
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Produkt ist nicht verfügbar
BUK7510-55AL,127 BUK7510-55AL.pdf
BUK7510-55AL,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
Produkt ist nicht verfügbar
BUK752R3-40C,127 BUK752R3-40C.pdf
BUK752R3-40C,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Produkt ist nicht verfügbar
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