EFX2S30K334C022LH Bussmann / Eaton
auf Bestellung 528 Stücke:
Lieferzeit 108-112 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
3+ | 1.17 EUR |
10+ | 0.83 EUR |
100+ | 0.55 EUR |
528+ | 0.4 EUR |
1056+ | 0.37 EUR |
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Technische Details EFX2S30K334C022LH Bussmann / Eaton
Description: CAP FILM 0.33UF 10% 305VAC RAD, Tolerance: ±10%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.669" (17.00mm), Part Status: Active, Capacitance: 0.33 µF, Size / Dimension: 1.024" L x 0.276" W (26.00mm x 7.00mm).
Weitere Produktangebote EFX2S30K334C022LH
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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EFX2S30K334C022LH | Hersteller : Eaton - Electronics Division |
Description: CAP FILM 0.33UF 10% 305VAC RAD Tolerance: ±10% Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: EMI, RFI Suppression Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Ratings: X2 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 305V Voltage Rating - DC: 630V Height - Seated (Max): 0.669" (17.00mm) Part Status: Active Capacitance: 0.33 µF Size / Dimension: 1.024" L x 0.276" W (26.00mm x 7.00mm) |
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