EFPLS63J273B022LH Bussmann / Eaton
auf Bestellung 867 Stücke:
Lieferzeit 94-98 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 1.97 EUR |
| 10+ | 1.49 EUR |
| 100+ | 1.11 EUR |
| 500+ | 0.89 EUR |
| 867+ | 0.78 EUR |
| 2601+ | 0.73 EUR |
| 5202+ | 0.7 EUR |
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Technische Details EFPLS63J273B022LH Bussmann / Eaton
Description: CAP FILM 0.027UF 5% 630VDC RAD, Tolerance: ±5%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 105°C, Applications: High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 0.492" (12.50mm), Capacitance: 0.027 µF, ESR (Equivalent Series Resistance): 25 mOhms, Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm).
Weitere Produktangebote EFPLS63J273B022LH
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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EFPLS63J273B022LH | Hersteller : Eaton - Electronics Division |
 Description: CAP FILM 0.027UF 5% 630VDC RADTolerance: ±5% Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: High Frequency, Switching; High Pulse, DV/DT Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - DC: 630V Height - Seated (Max): 0.492" (12.50mm) Capacitance: 0.027 µF ESR (Equivalent Series Resistance): 25 mOhms Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm) |
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