APF19-19-13CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 9449 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.77 EUR |
10+ | 5.62 EUR |
25+ | 5.47 EUR |
50+ | 5.16 EUR |
100+ | 4.86 EUR |
250+ | 4.56 EUR |
500+ | 4.4 EUR |
1000+ | 3.95 EUR |
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Technische Details APF19-19-13CB/A01 CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-13CB/A01 nach Preis ab 8.98 EUR bis 10.65 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
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APF19-19-13CB/A01 | Hersteller : CTS Electronic Components | Heat Sinks 19x19x13mm Heat Sink 0.13mm 4000V/mil |
auf Bestellung 1152 Stücke: Lieferzeit 10-14 Tag (e) |
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