W66AP6NBUAHJ TR Winbond Electronics
Hersteller: Winbond Electronics
Description: 1GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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Technische Details W66AP6NBUAHJ TR Winbond Electronics
Description: 1GB LPDDR4, X16, 2133MHZ, -40C~1, Packaging: Tape & Reel (TR), Package / Case: 200-WFBGA, Mounting Type: Surface Mount, Memory Size: 1Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 105°C (TC), Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR4, Clock Frequency: 2.133 GHz, Memory Format: DRAM, Supplier Device Package: 200-WFBGA (10x14.5), Write Cycle Time - Word, Page: 18ns, Memory Interface: LVSTL_11, Access Time: 3.6 ns, Memory Organization: 64M x 16.
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Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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W66AP6NBUAHJ TR | Hersteller : Winbond | DRAM 1Gb LPDDR4, x16, 2133MHz, -40C~105C, T&R |
Produkt ist nicht verfügbar |