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TMS5703135CZWTQQ1 Texas Instruments
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Description: IC MCU 16/32B 3MB FLASH 337NFBGA
Packaging: Tray
Package / Case: 337-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-R4F
Data Converters: A/D 24x12b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 3.6V
Connectivity: CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 337-NFBGA (16x16)
Number of I/O: 120
DigiKey Programmable: Not Verified
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Technische Details TMS5703135CZWTQQ1 Texas Instruments
Description: IC MCU 16/32B 3MB FLASH 337NFBGA, Packaging: Tray, Package / Case: 337-LFBGA, Mounting Type: Surface Mount, Speed: 180MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 256K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: ARM® Cortex®-R4F, Data Converters: A/D 24x12b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.14V ~ 3.6V, Connectivity: CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 337-NFBGA (16x16), Number of I/O: 120, DigiKey Programmable: Not Verified.