TDA4VM88TGBALFQ1 Texas Instruments
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Description: PROTOTYPE
Packaging: Bulk
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Qualification: AEC-Q100
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Technische Details TDA4VM88TGBALFQ1 Texas Instruments
Description: PROTOTYPE, Packaging: Bulk, Package / Case: 827-BFBGA, FCBGA, Speed: 2GHz, 1GHz, 1.35GHz, 1GHz, RAM Size: 1.5MB, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB, Peripherals: DMA, PWM, WDT, Supplier Device Package: 827-FCBGA (24x24), Architecture: DSP, MCU, MPU, Grade: Automotive, Qualification: AEC-Q100.