Suchergebnisse für "tda4vm" : 23
Art der Ansicht :
Mindestbestellmenge: 250
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TDA4VM88TGBALFR | Texas Instruments |
 Description: NEXT GENERATION SOC FAMILY FOR LPackaging: Cut Tape (CT) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 494 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VM88TGBALFR | Texas Instruments |
Description: NEXT GENERATION SOC FAMILY FOR L Packaging: Tape & Reel (TR) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VM88TGBALFR | Texas Instruments |
Microprocessors - MPU Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators 827-FCBGA -40 to 105 |
auf Bestellung 239 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VM88TGBALFRQ1 | Texas Instruments |
Microprocessors - MPU Automotive system-on-a-chip for L2, L3 and near-field analytic systems using deep learning 827-FCBGA -40 to 125 |
auf Bestellung 467 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VM88TGBALFRQ1 | Texas Instruments |
Description: NEXT GENERATION SOC FAMILY FOR L Packaging: Cut Tape (CT) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 233 Stücke: Lieferzeit 10-14 Tag (e) |
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102110646 | BEAGLEBOARD |
Description: BEAGLEBOARD - 102110646 - SBC, BeagleBone AI-64, TDA4VM, ARM Cortex-A72, 64 Bit, 8MB RAM, 4GB RAM, 16GB eMMC, WiFi tariffCode: 84715000 Prozessorkern: TDA4VM productTraceability: No rohsCompliant: YES Prozessorarchitektur: ARM Prozessorfamilie: - Prozessorhersteller: Texas Instruments Lieferumfang des Kits: Board TDA4VM euEccn: NLR Prozessorserie: Cortex-A72 hazardous: false rohsPhthalatesCompliant: TBA usEccn: 5A992.c |
auf Bestellung 167 Stücke: Lieferzeit 14-21 Tag (e) |
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BEAGL-BONE-AI-64 | Texas Instruments |
Description: BEAGLEBONE AI-64 EMBEDDED COMPUT Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A72 Utilized IC / Part: TDA4VM Platform: BeagleBoard |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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BEAGL-BONE-AI-64 | Texas Instruments | Single Board Computers BeagleBone AI-64 embedded computing board based on Jacinto TDA4VM Arm Cortex-72 processor |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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J721EXSKG01EVM | Texas Instruments |
Development Boards & Kits - Other Processors TDA4VM processor starter kit for Edge AI vision systems |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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J721EXSKG01EVM | Texas Instruments |
Description: TDA4VM PROCESSOR STARTER KIT FOR Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A72, Cortex®-R5F Board Type: Evaluation Platform Utilized IC / Part: TDA4VM Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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J721EXSOMG01EVM | Texas Instruments |
Description: TDA4VM AND DRA829V SOCKETED SYST Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A72, Cortex®-R5F Utilized IC / Part: DRA829V, TDA4VM |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA4VM88TGBALFR | Texas Instruments |
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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| TDA4VM88TGBALFR | Texas Instruments |
DSP Floating-Point 64bit 2GHz T/R |
Produkt ist nicht verfügbar |
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TDA4VM88TGBALFR | Texas Instruments |
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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TDA4VM88TGBALFRQ1 | Texas Instruments |
Description: NEXT GENERATION SOC FAMILY FOR L Packaging: Tape & Reel (TR) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| TDA4VM88TGBALFRQ1 | Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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| TDA4VM88TGBALFRQ1 | Texas Instruments |
TDA4VM88TGBALFRQ1 |
Produkt ist nicht verfügbar |
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| TDA4VM88TGBALFRQ1 | Texas Instruments |
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R |
Produkt ist nicht verfügbar |
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| TDA4VM88TRBALFQ1 | Texas Instruments |
Description: PROTOTYPE Packaging: Bulk Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU |
Produkt ist nicht verfügbar |
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conga-STDA4/i-TDA4VM-2G eMMC32 MAYA-W260 | congatec |
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72 |
Produkt ist nicht verfügbar |
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conga-STDA4/i-TDA4VM-2G eMMC32conga-STDA | congatec |
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72 |
Produkt ist nicht verfügbar |
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conga-STDA4/i-TDA4VM-4G eMMC32conga-STDA | congatec |
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72 |
Produkt ist nicht verfügbar |
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| J721EXSKG01EVM | Texas Instruments |
J721EXSKG01EVM |
Produkt ist nicht verfügbar |
| TDA4VM88TGBALFR |
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Hersteller: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 494 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 183.5 EUR |
| 10+ | 174.04 EUR |
| 25+ | 169.3 EUR |
| 100+ | 157.46 EUR |
| TDA4VM88TGBALFR |
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Hersteller: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Tape & Reel (TR)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Tape & Reel (TR)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 250+ | 153.91 EUR |
| TDA4VM88TGBALFR |
|
Hersteller: Texas Instruments
Microprocessors - MPU Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators 827-FCBGA -40 to 105
Microprocessors - MPU Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators 827-FCBGA -40 to 105
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 189.97 EUR |
| 10+ | 180.17 EUR |
| 25+ | 175.28 EUR |
| 50+ | 171.88 EUR |
| 100+ | 163.01 EUR |
| 250+ | 159.33 EUR |
| 500+ | 157.98 EUR |
| TDA4VM88TGBALFRQ1 |
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Hersteller: Texas Instruments
Microprocessors - MPU Automotive system-on-a-chip for L2, L3 and near-field analytic systems using deep learning 827-FCBGA -40 to 125
Microprocessors - MPU Automotive system-on-a-chip for L2, L3 and near-field analytic systems using deep learning 827-FCBGA -40 to 125
auf Bestellung 467 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 190.91 EUR |
| 10+ | 181.88 EUR |
| 25+ | 178.01 EUR |
| 50+ | 177.65 EUR |
| 100+ | 176.07 EUR |
| 250+ | 166.41 EUR |
| 500+ | 166.09 EUR |
| TDA4VM88TGBALFRQ1 |
|
Hersteller: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 184.43 EUR |
| 10+ | 175.71 EUR |
| 25+ | 171.97 EUR |
| 102110646 |
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Hersteller: BEAGLEBOARD
Description: BEAGLEBOARD - 102110646 - SBC, BeagleBone AI-64, TDA4VM, ARM Cortex-A72, 64 Bit, 8MB RAM, 4GB RAM, 16GB eMMC, WiFi
tariffCode: 84715000
Prozessorkern: TDA4VM
productTraceability: No
rohsCompliant: YES
Prozessorarchitektur: ARM
Prozessorfamilie: -
Prozessorhersteller: Texas Instruments
Lieferumfang des Kits: Board TDA4VM
euEccn: NLR
Prozessorserie: Cortex-A72
hazardous: false
rohsPhthalatesCompliant: TBA
usEccn: 5A992.c
Description: BEAGLEBOARD - 102110646 - SBC, BeagleBone AI-64, TDA4VM, ARM Cortex-A72, 64 Bit, 8MB RAM, 4GB RAM, 16GB eMMC, WiFi
tariffCode: 84715000
Prozessorkern: TDA4VM
productTraceability: No
rohsCompliant: YES
Prozessorarchitektur: ARM
Prozessorfamilie: -
Prozessorhersteller: Texas Instruments
Lieferumfang des Kits: Board TDA4VM
euEccn: NLR
Prozessorserie: Cortex-A72
hazardous: false
rohsPhthalatesCompliant: TBA
usEccn: 5A992.c
auf Bestellung 167 Stücke:
Lieferzeit 14-21 Tag (e)| BEAGL-BONE-AI-64 |
Hersteller: Texas Instruments
Description: BEAGLEBONE AI-64 EMBEDDED COMPUT
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: TDA4VM
Platform: BeagleBoard
Description: BEAGLEBONE AI-64 EMBEDDED COMPUT
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: TDA4VM
Platform: BeagleBoard
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 360.43 EUR |
| BEAGL-BONE-AI-64 |
Hersteller: Texas Instruments
Single Board Computers BeagleBone AI-64 embedded computing board based on Jacinto TDA4VM Arm Cortex-72 processor
Single Board Computers BeagleBone AI-64 embedded computing board based on Jacinto TDA4VM Arm Cortex-72 processor
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 454.8 EUR |
| 10+ | 435.62 EUR |
| J721EXSKG01EVM |
|
Hersteller: Texas Instruments
Development Boards & Kits - Other Processors TDA4VM processor starter kit for Edge AI vision systems
Development Boards & Kits - Other Processors TDA4VM processor starter kit for Edge AI vision systems
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 542.04 EUR |
| J721EXSKG01EVM |
|
Hersteller: Texas Instruments
Description: TDA4VM PROCESSOR STARTER KIT FOR
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72, Cortex®-R5F
Board Type: Evaluation Platform
Utilized IC / Part: TDA4VM
Part Status: Active
Description: TDA4VM PROCESSOR STARTER KIT FOR
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72, Cortex®-R5F
Board Type: Evaluation Platform
Utilized IC / Part: TDA4VM
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 472.35 EUR |
| J721EXSOMG01EVM |
|
Hersteller: Texas Instruments
Description: TDA4VM AND DRA829V SOCKETED SYST
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72, Cortex®-R5F
Utilized IC / Part: DRA829V, TDA4VM
Description: TDA4VM AND DRA829V SOCKETED SYST
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72, Cortex®-R5F
Utilized IC / Part: DRA829V, TDA4VM
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 758.81 EUR |
| TDA4VM88TGBALFR |
|
Hersteller: Texas Instruments
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R
Produkt ist nicht verfügbar
| TDA4VM88TGBALFR |
|
Hersteller: Texas Instruments
DSP Floating-Point 64bit 2GHz T/R
DSP Floating-Point 64bit 2GHz T/R
Produkt ist nicht verfügbar
| TDA4VM88TGBALFR |
|
Hersteller: Texas Instruments
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R
DSP Floating-Point 64bit 2GHz 827-Pin FCBGA T/R
Produkt ist nicht verfügbar
| TDA4VM88TGBALFRQ1 |
|
Hersteller: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Tape & Reel (TR)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Tape & Reel (TR)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TDA4VM88TGBALFRQ1 |
|
Hersteller: Texas Instruments
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R
Produkt ist nicht verfügbar
| TDA4VM88TGBALFRQ1 |
|
Hersteller: Texas Instruments
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R
DSP Floating-Point 64bit 2GHz Automotive AEC-Q100 827-Pin FCBGA T/R
Produkt ist nicht verfügbar
| TDA4VM88TRBALFQ1 |
Hersteller: Texas Instruments
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Produkt ist nicht verfügbar
| conga-STDA4/i-TDA4VM-2G eMMC32 MAYA-W260 |
|
Hersteller: congatec
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Produkt ist nicht verfügbar
| conga-STDA4/i-TDA4VM-2G eMMC32conga-STDA |
|
Hersteller: congatec
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Produkt ist nicht verfügbar
| conga-STDA4/i-TDA4VM-4G eMMC32conga-STDA |
|
Hersteller: congatec
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Computer-On-Modules - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Produkt ist nicht verfügbar