S1C17M23F001100 Epson Electronics America Inc-Semiconductor Div
Hersteller: Epson Electronics America Inc-Semiconductor DivDescription: IC MCU 16BIT 32KB FLASH 24SQFN4
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 21MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: S1C17
Data Converters: A/D 12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 24-SQFN4 (4x4)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details S1C17M23F001100 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 32KB FLASH 24SQFN4, Packaging: Tray, Package / Case: 24-VFQFN Exposed Pad, Mounting Type: Surface Mount, Speed: 21MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: S1C17, Data Converters: A/D 12b SAR, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Connectivity: I2C, IrDA, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT, Supplier Device Package: 24-SQFN4 (4x4), DigiKey Programmable: Not Verified.