S1C17M01F201100-160 Epson Electronics America Inc-Semiconductor Div


id002548.pdf Hersteller: Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 32KB FLASH 64TQFP13
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 16.3MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: S1C17
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: AMRC, LCD, PWM, RFC, Voltage Detect, WDT
Supplier Device Package: 64-TQFP13 (10x10)
Number of I/O: 19
DigiKey Programmable: Not Verified
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Technische Details S1C17M01F201100-160 Epson Electronics America Inc-Semiconductor Div

Description: IC MCU 16BIT 32KB FLASH 64TQFP13, Packaging: Tray, Package / Case: 64-TQFP, Mounting Type: Surface Mount, Speed: 16.3MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: S1C17, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Connectivity: I2C, IrDA, SPI, UART/USART, Peripherals: AMRC, LCD, PWM, RFC, Voltage Detect, WDT, Supplier Device Package: 64-TQFP13 (10x10), Number of I/O: 19, DigiKey Programmable: Not Verified.