RP605Z363B-E2-F Nisshinbo Micro Devices Inc.
Hersteller: Nisshinbo Micro Devices Inc.Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Cut Tape (CT)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
auf Bestellung 4250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.91 EUR |
| 10+ | 3.52 EUR |
| 25+ | 3.32 EUR |
| 100+ | 2.83 EUR |
| 250+ | 2.66 EUR |
| 500+ | 2.33 EUR |
| 1000+ | 1.93 EUR |
| 2500+ | 1.79 EUR |
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Technische Details RP605Z363B-E2-F Nisshinbo Micro Devices Inc.
Description: 300MA ULTRA-LOW POWER BUCK BOOST, Packaging: Tape & Reel (TR), Package / Case: 20-XFBGA, WLCSP, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.8V ~ 5.5V, Applications: Battery Management, Power Supplies, Current - Supply: 300nA, Supplier Device Package: 20-WLCSP-P3 (2.32x1.71).
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RP605Z363B-E2-F | Hersteller : Nisshinbo Micro Devices Inc. |
Description: 300MA ULTRA-LOW POWER BUCK BOOST Packaging: Tape & Reel (TR) Package / Case: 20-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Applications: Battery Management, Power Supplies Current - Supply: 300nA Supplier Device Package: 20-WLCSP-P3 (2.32x1.71) |
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