R5F21326HJSP#X4 Renesas Electronics Corporation


r8c26-r8c27-group-datasheet?r=1053571 Hersteller: Renesas Electronics Corporation
Description: MCU3 R8C/TINY(AUTO) _FLASH S020P
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Program Memory Type: FLASH
Core Processor: R8C
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SIO, SSU, UART/USART
Peripherals: POR, PWM, Voltage Detect, WDT
Supplier Device Package: 20-LSSOP
Number of I/O: 15
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Technische Details R5F21326HJSP#X4 Renesas Electronics Corporation

Description: MCU3 R8C/TINY(AUTO) _FLASH S020P, Packaging: Tape & Reel (TR), Package / Case: 20-LSSOP (0.173", 4.40mm Width), Mounting Type: Surface Mount, Speed: 20MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2.5K x 8, Operating Temperature: -40°C ~ 85°C (TA), Program Memory Type: FLASH, Core Processor: R8C, Data Converters: A/D 4x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: I2C, LINbus, SIO, SSU, UART/USART, Peripherals: POR, PWM, Voltage Detect, WDT, Supplier Device Package: 20-LSSOP, Number of I/O: 15.