R4F2113DBG#U0 Renesas Electronics Corporation
Hersteller: Renesas Electronics Corporation
Description: H8S/2113 128K WIDE TEMP 176 BGA
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Number of I/O: 130
Package / Case: 176-LFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: H8S/2000
Data Converters: A/D 12x10b SAR
Core Size: 16-Bit
Connectivity: FIFO, I2C, LPC, SCI, SSU, UART/USART
Peripherals: LVD, POR, PWM, TPU, WDT
Supplier Device Package: 176-LFBGA (13x13)
Description: H8S/2113 128K WIDE TEMP 176 BGA
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Number of I/O: 130
Package / Case: 176-LFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: H8S/2000
Data Converters: A/D 12x10b SAR
Core Size: 16-Bit
Connectivity: FIFO, I2C, LPC, SCI, SSU, UART/USART
Peripherals: LVD, POR, PWM, TPU, WDT
Supplier Device Package: 176-LFBGA (13x13)
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Technische Details R4F2113DBG#U0 Renesas Electronics Corporation
Description: H8S/2113 128K WIDE TEMP 176 BGA, Packaging: Tray, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Number of I/O: 130, Package / Case: 176-LFBGA, Mounting Type: Surface Mount, Speed: 20MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 12K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 8K x 8, Core Processor: H8S/2000, Data Converters: A/D 12x10b SAR, Core Size: 16-Bit, Connectivity: FIFO, I2C, LPC, SCI, SSU, UART/USART, Peripherals: LVD, POR, PWM, TPU, WDT, Supplier Device Package: 176-LFBGA (13x13).