MT61M256M32KPA-14 AAT:C TR Micron Technology Inc.
Hersteller: Micron Technology Inc.
Description: IC DRAM 8GBIT PAR 180FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.21V ~ 1.29V
Technology: SGRAM - GDDR6
Clock Frequency: 1.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 8GBIT PAR 180FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.21V ~ 1.29V
Technology: SGRAM - GDDR6
Clock Frequency: 1.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
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Technische Details MT61M256M32KPA-14 AAT:C TR Micron Technology Inc.
Description: IC DRAM 8GBIT PAR 180FBGA, Packaging: Tape & Reel (TR), Package / Case: 180-TFBGA, Mounting Type: Surface Mount, Memory Size: 8Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 105°C (TC), Voltage - Supply: 1.21V ~ 1.29V, Technology: SGRAM - GDDR6, Clock Frequency: 1.5 GHz, Memory Format: DRAM, Supplier Device Package: 180-FBGA (12x14), Part Status: Obsolete, Memory Interface: Parallel, Memory Organization: 256M x 32, DigiKey Programmable: Not Verified.