MPF7100BMBA0ESR2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: POWER MANAGEMENT IC, I.MX 8, I.M
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MPF7100BMBA0ESR2 NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8, I.M, Packaging: Tape & Reel (TR), Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: i.MX Processors, Current - Supply: 10µA, Supplier Device Package: 48-HVQFN (7x7), Grade: Automotive, Qualification: AEC-Q100.