MMF006630 Micro-Measurements (Division of Vishay Precision Group)
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Description: 1240-FPA SILVER SOLDER PASTE --
Packaging: Jar
Composition: Ag40Cu30Zn28Ni2 (40/30/28/2)
Type: Solder Paste
Melting Point: 1220 ~ 1435°F (660 ~ 780°C)
Form: Jar, 1 oz (28g)
Process: Lead Free
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 9 Months
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Technische Details MMF006630 Micro-Measurements (Division of Vishay Precision Group)
Description: 1240-FPA SILVER SOLDER PASTE --, Packaging: Jar, Composition: Ag40Cu30Zn28Ni2 (40/30/28/2), Type: Solder Paste, Melting Point: 1220 ~ 1435°F (660 ~ 780°C), Form: Jar, 1 oz (28g), Process: Lead Free, Part Status: Active, Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 9 Months.