![MFS2303BMBA3EPR2 MFS2303BMBA3EPR2](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/6130/Mfg_568%7ESOT619-27%28D%29%7E%7E48.jpg)
MFS2303BMBA3EPR2 NXP USA Inc.
![FS23_SBC.pdf](/images/adobe-acrobat.png)
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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Technische Details MFS2303BMBA3EPR2 NXP USA Inc.
Description: IC, Packaging: Tape & Reel (TR), Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 40V, Applications: System Basis Chip, Current - Supply: 40µA, Supplier Device Package: 48-HVQFN (7x7).