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MCIMX6S6AVM08AB,557 NXP USA Inc.


IMX6SDLAEC.pdf Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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Technische Details MCIMX6S6AVM08AB,557 NXP USA Inc.

Description: IC MPU I.MX6S 800MHZ 624MAPBGA, Packaging: Tray, Package / Case: 624-LFBGA, Mounting Type: Surface Mount, Speed: 800MHz, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A9, Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V, Supplier Device Package: 624-MAPBGA (21x21), Ethernet: 10/100/1000Mbps (1), USB: USB 2.0 + PHY (4), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Multimedia; NEON™ SIMD, RAM Controllers: DDR3, DDR3L, LPDDR2, Graphics Acceleration: Yes, Display & Interface Controllers: Keypad, LCD, Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection.