LPC812M101JTB16115 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 16KB FLASH 16XSON
Packaging: Bulk
Package / Case: 16-XFDFN
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-XSON (3.2x2.5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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Technische Details LPC812M101JTB16115 NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16XSON, Packaging: Bulk, Package / Case: 16-XFDFN, Mounting Type: Surface Mount, Speed: 30MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0+, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I²C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, Supplier Device Package: 16-XSON (3.2x2.5), Part Status: Active, Number of I/O: 14, DigiKey Programmable: Not Verified.